Electro-optical device

ABSTRACT

An object of the present invention is to realize a numerical aperture higher than that of a pixel having a conventional construction by using a pixel circuit having a novel construction in an electro-optical device. Therefore, it is utilized that the electric potential of a gate signal line in a row except for an i-th row is set to a constant electric potential in a period except for when a gate signal line ( 106 ) in the i-th row is selected. A gate signal line  111  in an (i−1)-th row is also used as an electric current supply line for an EL element ( 103 ) controlled by the gate signal line ( 106 ) in the i-th row. Thus, wiring number is reduced and high numerical aperture is realized.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the construction of an electro-opticaldevice. The present invention particularly relates to an active matrixtype electro-optical device having a thin film transistor (TFT) made onan insulating substrate.

2. Related Background Art

In recent years, an EL display has been attracting attentions as a flatpanel display that is to replace an LCD (liquid crystal display), and isactively researched. In the specification, the EL display has an ELelement which is also called a light emitting device or a light emittingdiode. Further, the EL (Electro Luminescence) includes triplet-basedlight emission or singlet-based light emission.

There are generally two types of driving system for the LCD display. Onetype is a passive matrix type used in an STN-LCD, etc. The other type isan active matrix type used in a TFT-LCD, etc. Similarly, there aregenerally two kinds of driving systems in the EL display. One type is apassive matrix type, and the other type is an active matrix type.

In the case of the passive matrix type, a wiring to serve as anelectrode is arranged in each of upper and lower portions of an ELelement. A voltage is sequentially applied to the wirings, and anelectric current flows through the EL element so that the EL element islighted.

In contrast to this, in the case of the active matrix type, each pixelshas a TFT, and a signal can be held within each pixels.

FIGS. 15A and 15B show a constructional example of the active matrixtype electro-optical device used in the EL display. FIG. 15A is a viewshowing the construction of the entire circuit in which a pixel portionis arranged in the center of this circuit. A gate signal line sidedriving circuit for controlling the operation of a gate signal line isarranged to the left of the pixel portion. A source signal line sidedriving circuit for controlling the operation of a source signal line isarranged above the pixel portion. In FIG. 15A, a portion surrounded by adotted line frame shows a circuit of one pixel. FIG. 15B shows anenlarged view of this circuit. In FIG. 15B, reference numeral 1501designates a TFT (hereinafter called a switching TFT) functioning as aswitching element when a signal is written into a pixel. In FIG. 15B,the switching TFT has a double gate structure, but may also have asingle gate structure, a triple gate structure or a multi-gate structurehaving more than three gates. One of polarities of the TFT may beselected in accordance with a constructional form of the circuit.Reference numeral 1502 designates a TFT (hereinafter called an ELdriving TFT) functioning as an element (an electric current controlelement) for controlling an electric current supplied to an EL element1503. In FIG. 15B, the TFT 1502 is arranged between an anode 1509 of theEL element 1503 and an electric current supply line 1507. In analternative constructional method, it is also possible to arrange theTFT 1502 between a cathode 1510 of the EL element 1503 and a cathodeelectrode 1508. One of polarities of the TFT may be selected inaccordance with the constructional form of the circuit. In this case, asystem is common and often used in which a p-channel type TFT is usedfor the EL driving TFT, and the EL driving TFT is arranged between theanode 1509 of the EL element 1503 and the electric current supply line1507, since source grounding is preferable as the operation of atransistor, and there is a restriction in manufacture of the EL element1503. Reference numeral 1504 designates a holding capacitor for holdinga signal (voltage) inputted from a source signal line 1505. One terminalof the holding capacitor 1504 in FIG. 15B is connected to the electriccurrent supply line 1507, but there is also a case in which dedicatedwiring is used. A gate terminal of the switching TFT 1501 is connectedto a gate signal line 1506, and a source terminal of this TFT 1501 isconnected to the source signal line 1505. A drain terminal of the ELdriving TFT 1502 is connected to the anode 1509 of the EL element 1503,and a source terminal of this TFT 1502 is connected to the electriccurrent supply line 1507.

An operation of the circuit of the active matrix type electro-opticaldevice will next be explained with reference to FIGS. 15A and 15B.First, when the gate signal line 1506 is selected, a voltage is appliedto a gate of the switching TFT 1501, and the switching TFT 1501 attainsa turned-ON state. Thus, a signal (voltage) of the source signal line1505 is accumulated in the holding capacitor 1504. The voltage of theholding capacitor 1504 becomes a voltage V_(GS) between the gate and thesource of the EL driving TFT 1502 so that an electric current accordingto the voltage of the holding capacitor 1504 flows through the ELdriving TFT 1502 and the EL element 1503. As a result, the EL element1503 is lighted.

Luminance of the EL element 1503, i.e., an electric current amountflowing through the EL element 1503 can be controlled by V_(GS). V_(GS)is the voltage of the holding capacitor 1504, and is a signal (voltage)inputted to the source signal line 1505. Namely, the luminance of the ELelement 1503 is controlled by controlling the signal (voltage) inputtedto the source signal line 1505. Finally, the gate signal line 1506 isset to a not selected state, and the gate of the switching TFT 1501 isclosed, and the switching TFT 1501 is set to a turned-OFF state. At thattime, electric charges accumulated in the holding capacitor 1504 areheld. Accordingly, V_(GS) is held as it is, and an electric currentaccording to V_(GS) continuously flows through the EL driving TFT 1502and the EL element 1503.

The descriptions above are reported in SID99 Digest: P372: “CurrentStatus and future of Light-Emitting Polymer Display Driven by Poly-SiTFT”, ASIA DISPLAY 98: P217: “High Resolution Light Emitting PolymerDisplay Driven by Low Temperature Polysilicon Thin Film Transistor withIntegrated Driver”, Euro Display99 Late News: P27: “3.8 Green OLED withLow Temperature Poly-Si TFT”, etc.

In the active matrix type electro-optical device, it is required thatthe pixel has a large holding capacity and high aperture ratio in viewof display performance of this device. Since each pixel has the highaperture ratio, utilization efficiency of light is improved and adisplay unit can be saved in power and made compact.

In recent years, the pixel is reduced in size and an image with higherdefinition is required. Since the pixel size is reduced, regions forforming the TFT and wiring come to occupy increased area in one pixel,and the aperture ratio of the pixel is reduced.

Therefore, efficient layout of circuit elements that are required in thecircuit construction of the pixel is indispensable to obtain a highaperture ratio of each pixel in the prescribed pixel size.

As mentioned above, a new pixel construction that has not conventionallybeen found is needed to realize the active matrix type electro-opticaldevice having a high pixel aperture ratio with a reduced mask number.

SUMMARY OF THE INVENTION

The present invention is made to meet such a request, and an object ofthe present invention is therefore to provide an electro-optical devicehaving a pixel realizing a high aperture ratio by using a pixel having anovel construction without increasing a mask number and a step number.

To solve the above problems of the prior art, the present invention hasthe following measures.

In the electro-optical device of the present invention, the attention ispaid to the fact that, in the construction of a pixel portion of thisdevice that a certain gate signal line has a constant electric potentialin a period except for a period where this gate signal line is selected.The electro-optical device of the present invention is characterized inthat, when a gate signal line in an i-th row is selected, one of thegate signal lines including the gate signal line in the i-th rowsubstitutes for an electric current supply line for supplying anelectric current to pixels in the i-th row. Thus, it is possible to omitthe electric current supply line occupying a not-so-small-area of thepixel portion. High aperture ratio can be realized by this method in thepixel portion without increasing a mask sheet number and a manufacturingstep number. Further, if the aperture ratio is set to be equal to theconventional aperture ratio, the width of a signal line can be increasedso that resistance and noises can be reduced and image quality can beimproved.

According to a first aspect of the present invention, there is providedan electro-optical device comprising a source signal line side drivingcircuit, a gate signal line side driving circuit and a pixel portion,characterized in that:

the source signal line side driving circuit has a plurality of sourcesignal lines;

the gate signal line side driving circuit has n(n is a natural number,1<n) gate signal lines;

the pixel portion has a structure in which a plurality of pixels arearranged in a matrix-like manner;

the a plurality of pixels controlled by a gate signal line scanned in ani-th column (1≦i≦n) among the n gate signal lines each have a switchingtransistor, an EL driving transistor, and an EL element;

a gate electrode of the switching transistor is electrically connectedto the gate signal line scanned in the i-th column;

one of a source region and a drain region of the switching transistor iselectrically connected to the source signal line, and the other iselectrically connected to a gate electrode of the EL driving transistor;and

one of a source region and a drain region of the EL driving transistoris electrically connected to one of the n gate signal lines, and theother is electrically connected to one electrode of the EL element.

According to a second aspect of the present invention, there is providedan electro-optical device comprising a source signal line side drivingcircuit, a gate signal line side driving circuit and a pixel portion,characterized in that:

the source signal line side driving circuit has a plurality of sourcesignal lines;

the gate signal line side driving circuit has n(n is a natural number,1<n) gate signal lines;

the pixel portion has a structure in which a plurality of pixels arearranged in a matrix-like manner;

the a plurality of pixels controlled by a gate signal line scanned in ani-th column (1≦i≦n) among the n gate signal lines respectively have aswitching transistor, an EL driving transistor, and an EL element;

a gate electrode of the switching transistor is electrically connectedto the gate signal line scanned in the i-th column;

one of a source region and a drain region of the switching transistor iselectrically connected to the source signal line, and the other iselectrically connected to a gate electrode of the EL driving transistor;

one of a source region and a drain region of the EL driving transistoris electrically connected to one of the n gate signal lines, and theother is electrically connected to one electrode of the EL element; and

an electric current applied to the EL element controlled by the gatesignal line scanned in the i-th column is supplied through one gatesignal line among the n gate signal lines electrically connected to oneof the source region and the drain region of the EL driving transistor.

According to a third aspect of the present invention, there is providedan electro-optical device comprising a source signal line side drivingcircuit, a gate signal line side driving circuit and a pixel portion,characterized in that:

the source signal line side driving circuit has a plurality of sourcesignal lines;

the gate signal line side driving circuit has n(n is a natural number,1<n)-gate signal lines;

the pixel portion has a structure in which a plurality of pixels arearranged in a matrix-like manner;

the a plurality of pixels controlled by a gate signal line scanned in ani-th column (1≦i≦n) among the n gate signal lines respectively have aswitching transistor, an EL driving transistor, and an EL element;

a gate electrode of the switching transistor is electrically connectedto the gate signal line scanned in the i-th column;

one of a source region and a drain region of the switching transistor iselectrically connected to the source signal line, and the other iselectrically connected to a gate electrode of the EL driving transistor;

one of a source region and a drain region of the EL driving transistoris electrically connected to one of the n gate signal lines, and theother is electrically connected to one electrode of the EL element;

the gate signal line scanned in the i-th column has a function forcontrolling operations of the a plurality of pixels electricallyconnected to the gate signal line scanned in the i-th column whenscanning the i-th column; and

when scanning the gate signal line for controlling the operations of thea plurality of pixels including a plurality of EL driving transistors ofwhich one of the source region and the drain region is electricallyconnected to the gate signal line in the i-th column, the gate signalline has a function as an electric current supply line for the ELelement arranged in each of the a plurality of pixels controlled by thegate signal line.

According to a fourth aspect of the present invention, theelectro-optical device of any one of the first to third aspects of theinvention is characterized in that:

polarity of the EL driving transistor electrically connected to the ELelement is p-channel type when a light emitting direction of the ELelement is a direction directed to a substrate on which a drivingcircuit is formed;

the polarity of the EL driving transistor electrically connected to theEL element is n-channel type when the light emitting direction of the ELelement is a direction reverse to the direction directed to thesubstrate on which the driving circuit is formed; and

polarity of the switching transistor is the same as the polarity of theEL driving transistor.

According to a fifth aspect of the present invention, theelectro-optical device of any one of first to fourth aspects of theinvention is characterized in that the gate signal line is formed byusing aluminum or a material having aluminum as a principal component.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIGS. 1A and 1B are, respectively, a plan view and a circuit diagram ofa pixel having a structure in which an electric current supply line anda gate signal line are common in the present invention;

FIGS. 2A and 2B are, respectively, a plan view and a circuit diagram ofa pixel of a structure having a dedicated electric current supply lineand a gate signal line;

FIG. 3 is a circuit diagram showing a situation in which the pixels eachhaving the structure having the common electric current supply line andgate signal line in the present invention are arranged in three rows andtwo columns;

FIG. 4 is a view for explaining a basic signal pattern for using thepixel of the present invention;

FIGS. 5A and 5B are diagrams showing a circuit constructional example ofan electro-optical device having the pixel of the present invention andshown in an embodiment 1;

FIG. 6 is a timing chart for explaining an example of driving theelectro-optical device having the pixel of the present invention andshown in the embodiment 1;

FIG. 7 is a timing chart for explaining an example of driving theelectro-optical device having the pixel of the present invention andshown in the embodiment 1;

FIGS. 8A to 8C are diagrams showing a manufacturing process example ofan electro-optical device shown in an embodiment 2;

FIGS. 9A to 9C are diagrams showing the manufacturing process example ofthe electro-optical device shown in the embodiment 2;

FIGS. 10A and 10B are diagrams showing the manufacturing process exampleof the electro-optical device shown in the embodiment 2;

FIGS. 11A and 11B are, respectively, a plan view and a cross-sectionalview of the electro-optical device shown in an embodiment 3;

FIGS. 12A and 12B are, respectively, a plan view and a cross-sectionalview of an electro-optical device shown in an embodiment 4;

FIG. 13 is a cross-sectional view of a pixel portion of anelectro-optical device shown in an embodiment 5;

FIG. 14 is a cross-sectional view of a pixel portion of anelectro-optical device shown in an embodiment 6;

FIGS. 15A and 15B are diagrams showing a circuit constructional exampleof the electro-optical device;

FIGS. 16A and 16B are timing charts for explaining an example of drivingan electro-optical device having the pixel of the present invention andshown in an embodiment 7;

FIGS. 17A and 17B are diagrams showing a circuit constructional exampleof the electro-optical device having the pixel of the present inventionand shown in the embodiment 7;

FIGS. 18A and 18B are timing charts for explaining an example of drivingan electro-optical device having the pixel of the present invention andshown in an embodiment 8;

FIGS. 19A and 19B are diagrams showing a circuit constructional exampleof the electro-optical device having the pixel of the present inventionand shown in the embodiment 8;

FIGS. 20A and 20B are diagrams showing a circuit constructional exampleof an electro-optical device having the pixel of the present inventionand shown in an embodiment 9;

FIGS. 21A and 21B are timing charts for explaining an example of drivingan electro-optical device having the pixel of the present invention andshown in an embodiment 10;

FIGS. 22A to 22F are diagrams showing examples of an electronic deviceinto which an electro-optical device of the present invention isassembled; and

FIGS. 23A and 23B are diagrams showing examples of an electronic deviceinto which an electro-optical device of the present invention isassembled.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be described with reference to FIGS. 1A to2B. FIGS. 2A and 2B show an EL pixel having a normal construction, andFIGS. 1A and 1B show an EL pixel having the construction of the presentinvention. Each of FIG. 1A and FIG. 2A shows a pixel plan view, and eachof FIG. 1B and FIG. 2B shows a pixel circuit diagram. In FIG. 2B,reference numerals 201, 202, and 203 respectively designate a switchingTFT, an EL driving TFT, and an EL pixel. Reference numerals 204, 205,and 206 respectively designate a holding capacitor, a source signalline, and a gate signal line. Reference numerals 207, 208, 209 and 210respectively designate an electric current supply line, a cathodeelectrode, an anode of the EL pixel, and a cathode of the EL pixel. InFIG. 1B, reference numerals 101, 102, and 103 respectively designate aswitching TFT, an EL driving TFT, and an EL pixel. Reference numerals104, 105, and 106 respectively designate a holding capacitor, a sourcesignal line, and a gate signal line scanned in an i-th row. Referencenumerals 108, 109, 110, and 111 respectively designate a cathode wiring,an anode of the EL pixel, a cathode of the EL pixel, and a gate signalline in a precedent adjacent row. As mentioned above, it is sufficientto determine polarities of the switching TFTs 101 and 201 may bedetermined in accordance with the structure of an EL element.

The switching TFTs in FIGS. 1A to 2B each have a double gate structure,but may also have a single gate structure, a triple gate structure or amulti-gate structure having more than three gates.

The gate signal line electrically connected to one of a source regionand a drain region of the EL driving TFT is not necessarily set to agate signal line in a precedent adjacent row.

In a conventional pixel construction, as shown in FIGS. 2A and 2B, thededicated electric current supply source 207 is arranged, and a sourceelectrode of the EL driving TFT 202 and an electrode of the holdingcapacitor 204 are connected to the electric current supply line 207. Incontrast to this, in the present invention, as shown in FIG. 1, thesource electrode of the EL driving TFT 102 and the electrode of theholding capacitor 104 are connected to the gate signal line 111 inanother row. In this case, it is desirable to connect the sourceelectrode of the TFT 102 and the electrode of the holding capacitor 104to the gate signal line scanned one row before from the relation of anarrangement and the relation of voltages of the respective portions.

FIG. 3 shows a circuit diagram in which pixels are arranged in threerows and two columns with respect to the circuit of one pixel shown inFIG. 1B. The pixels in FIG. 3 are similar to those in FIG. 1B.Therefore, reference numerals designated in FIG. 1B are also used inFIG. 3. In FIG. 3, a pixel portion controlled by the gate signal line106 in an i-th row is surrounded by a dotted line frame shown by A. Inthis figure, only two columns of pixels are shown, but pixels arecontinuously arranged in a column direction by a number corresponding tothe number of pixels in the horizontal direction of a panel. The sourceregion of the EL driving TFT 102 and the electrode of the holdingcapacitor 104 are connected to the gate signal line 111 in an (i−1)-throw. Since the gate signal lines are sequentially scanned in a downwarddirection from an upper row in this figure, the gate signal line isconnected to a gate signal line in the precedent row.

The point of the present invention is that the gate signal line in theprecedent row is already returned to a not-selected state when a signalis being written into the row selected at present. An electric potentialof the gate signal line is kept constant (in the not-selected state)until the gate signal line is again selected. Therefore, the presentinvention is characterized in that the gate signal line in the precedentrow is treated as a constant electric potential line, i.e., an electriccurrent supply line. Namely, the gate signal line and the electriccurrent supply line are common. As a result, wiring number can bereduced and aperture ratio can be improved.

FIG. 4 shows a basic signal pattern for driving the electro-opticaldevice of the present invention shown in FIGS. 1A and 1B. Here, FIG. 4shows an example in which the polarity of the switching TFT and the ELdriving TFT is both p-channel type with respect to the electricpotentials of the respective portions. FIG. 4 shows signal patterns inwirings in four rows from an (i−1)-th row to an (i+2)-th row in pixelsin the same column (pixels connected to a certain one source signalline). For explanation, time is divided into a period A to a period F.

First, in each row, a gate signal line is selected and shifted to thenext row. Since the switching TFT is of p-channel type, the switchingTFT attains a turned-ON state when a voltage of the gate signal line issufficiently lower than an electric potential of the source region ofthe switching TFT (namely, when |V_(GS)| exceeds a threshold voltage ofthe switching TFT). It is necessary to set the voltage of the gatesignal line at that time to be sufficiently lower than the lowestelectric potential on a source signal line so that the voltage of thesource signal line is written into a pixel. First, in the (i−1)-th row,the gate signal line is selected in a period B. In the i-th row, thegate signal line is selected in a period C. In the (i+1)-th row, thegate signal line is selected in a period D. In the (i+2)-th row, thegate signal line is selected in a period E. Thus, in each row, the gatesignal line is selected and shifted to the next row.

The electric potential of the source signal line will next be described.Here, the pixel in each row is connected to the source signal line in acertain one column. Accordingly, the electric potential of the sourcesignal line is the same from the (i−1)-th row to the (i+2)-th row. Here,in the periods A and D, the electric potential of the source signal lineat the ends of the periods is in a high (Hi) signal state. In theperiods B, C, E and F, the electric potential of the source signal lineat the ends of the periods is in a low (LO) signal state. The actualelectric potential of the source signal line has various values inaccordance with a display pattern.

The electric potential of the gate electrode of the EL driving TFT ineach pixel will next be described. The i-th row will first beconsidered. In a period prior to the period A, the electric potential ofthe gate electrode of the EL driving TFT in a pixel in the i-th row isin a high state. In the period B, the electric potential of the gateelectrode of the EL driving TFT in the pixel in the i-th row is lowered.This is because one electrode of the holding capacitor in the i-th rowis connected to the gate signal line in the (i−1)-th row, and the gatesignal line in this (i−1)-th row is selected, and the voltage of thegate signal line in the (i−1)-th row is reduced. Namely, there areelectric charges already accumulated in the holding capacitor, and avoltage according to these electric charges is applied to both terminalsof the holding capacitor. In this state, one electrode of the holdingcapacitor, i.e., the voltage of the gate signal line in the (i−1)-th rowis reduced. Thus, since the switching TFT in the i-th row is in aturned-OFF state, the electric charges of the holding capacitor in thepixel in the i-th row, i.e., the voltage of both the terminals of theholding capacitor is held as it is. The other electrode of the holdingcapacity, i.e., the voltage of the gate electrode of the EL driving TFTin the i-th row is also reduced to the same extent. Accordingly, thevoltage of both the terminals of the holding capacitor, i.e., thevoltage between the gate and the source of the EL driving TFT in thei-th row is not changed even when the voltage of the gate signal line inthe (i−1)-th row is changed.

In this case, an absolute value of the voltage between the gate and thesource of the EL driving TFT in the pixel in the i-th row is small inthe period A so that no electric current flows through the EL elementand the EL element is in a non light-emitting state. Accordingly, theelectric potential of the gate electrode of the EL driving TFT isreduced in the period B, but the electric potential of the sourceelectrode of the EL driving TFT is also simultaneously reduced.Therefore, the voltage between the gate and the source of the EL drivingTFT is equal in the periods A and B. Accordingly, in the period B, noelectric current flows through the EL element in the pixel in the i-throw. Even when the EL driving TFT is in a turned-ON state, it is assumedthat the electric potential of the source electrode of the EL drivingTFT is reduced and is lower than the electric potential of a cathodewiring of the EL element in the period B. Therefore, no forward biasvoltage is applied to the EL element so that no electric current flowsthrough the EL element. The voltage of the gate signal line in the(i−1)-th row is returned to the original state at the end of the periodB. As a result, the electric potential of the gate electrode of the ELdriving TFT in the pixel in the i-th row is also returned to theoriginal state.

The period C is next started. In the period C, the gate signal line inthe i-th row is selected. Accordingly, the electric potential of thegate electrode of the EL driving TFT in the pixel in the i-th rowbecomes the same as the electric potential of the source signal line. Inthe period C, the source signal line is set to a state of a low (LO)signal. Therefore, the electric potential of the gate electrode of theEL driving TFT in the pixel in the i-th row is also equal to theelectric potential of the source signal line and is therefore low. Atthat time, one electrode of the holding capacitor, i.e., the a electricpotential of the gate signal line in the (i−1)-th row is alreadyreturned to a high state. Therefore, the voltage between the gate signalline in the (i−1)-th row and the gate electrode of the EL driving TFT inthe pixel in the i-th row is applied to the holding capacitor so thatthe absolute value of the voltage between the gate and the source of theEL driving TFT in the pixel in the i-th row is increased. Accordingly,the EL driving TFT in the pixel in the i-th row attains a turned-ONstate. The electric potential of the gate signal line in the (i−1)-throw, i.e., the electric potential of the source electrode of the ELdriving TFT in the pixel in the i-th row is already returned to a highstate so that the electric potential of an anode of the EL element inthe i-th row is higher than that of the cathode wiring. As a result, anelectric current flows through the EL element in the i-th row and lightis emitted from the EL element. The electric current flowing through theEL element in the i-th row is supplied through the gate signal line inthe (i−1)-th row. Accordingly, it is necessary to set wiring resistanceof the gate signal line in each row to be sufficiently low.

The period D is next started. In the period D, the voltage of the gatesignal line in the i-th row is returned to the original state, and theswitching TFT in the i-th row attains a turned-OFF state. The electricpotential of the gate electrode of the EL driving TFT in the pixel inthe i-th row is held as it is. At this time, the electric potential ofthe gate signal line in the (i−1)-th row, i.e., the electric potentialsof the electrode of the holding capacitor in the pixel in the i-th rowand the source electrode of the EL driving TFT are not changed fromtheir present values. Accordingly, hereinafter, the EL driving TFT inthe pixel in the i-th row attains a turned-ON state, and an electriccurrent continuously flows through the EL element in the i-th row.

Similarly, an (i+1)-th row will be considered. In a period prior to theperiod B, the electric potential of the gate electrode of the EL drivingTFT in the pixel in the (i+1)-th row is in a high state. In the periodC, the electric potential of the gate electrode of the EL driving TFT inthe pixel in the (i+1)-th row is reduced. This is because one electrodeof the holding capacitor in the (i+1)-th row is connected to the gatesignal line in the i-th row, and the gate signal line in this i-th rowis selected, and the voltage of the gate signal line in the i-th row isreduced. At the end of the period C, the voltage of the gate signal linein the i-th row is returned to the original state, and the electricpotential of the gate electrode of the EL driving TFT in the pixel inthe (i+1)-th row is also returned to the original state.

The period D is next started. In the period D, the gate signal line inthe (i+1)-th row is selected. Accordingly, the electric potential of thegate electrode of the EL driving TFT in the pixel in the (i+1)-th rowbecomes the same as the electric potential of the source signal line. Inthe period D, the source signal line is in a high (H) signal state.Accordingly, the electric potential of the gate electrode of the ELdriving TFT in the pixel in the (i+1)-th row becomes the same electricpotential as the source signal line, and also becomes Hi. At that time,one electrode of the holding capacitor, i.e., the electric potential ofthe gate signal line in the i-th row is already returned to a highstate. Accordingly, the voltage between the gate signal line in the i-throw and the gate electrode of the EL driving TFT in the pixel in the(i+1)-th row is applied to the holding capacitor so that the absolutevalue of the voltage between the gate and the source of the EL drivingTFT is reduced. Accordingly, the EL driving TFT in the pixel in the(i+1)-th row attains a turned-OFF state, and no electric current flowsthrough the EL element in the (i+1)-th row, and no light is emitted fromthe EL element.

The period E is next started. In the period E, the voltage of the gatesignal line in the (i+1)-th row is returned to the original state, andthe switching TFT in the (i+1)-th row attains a not-selected state. Theelectric potential of the gate electrode of the EL driving TFT in thepixel in the (i+1)-th row is held as it is. The electric potential ofthe gate signal line in the i-th row, i.e., the electric potentials ofthe electrode of the holding capacitor in the pixel in the (i+1)-th rowand the source electrode of the EL driving TFT are not changed fromtheir present values. Accordingly, hereinafter, the EL driving TFT inthe pixel in the (i+1)-throw attains a turned-OFF state, and a state inwhich no electric current flows through the EL element in the (i+1)-throw lasts.

Similarly, an (i+2)-th row will be considered. In a period prior to theperiod C, the electric potential of the gate electrode of the EL drivingTFT in the pixel in the (i+2)-th row is set to a low state. In theperiod D, the electric potential of the gate electrode of the EL drivingTFT in the pixel in the (i+2)-th row is reduced. This is because oneelectrode of the holding capacitor in the (i+2)-th row is connected tothe gate signal line in the (i+1)-th row, and the gate signal line inthis (i+1)-th row is selected, and the voltage of the gate signal linein the (i+1)-th row is reduced. In a period prior to the period C, theabsolute value of the voltage between the gate and the source of the ELdriving TFT in the pixel in the (i+2)-th row is large so that anelectric current flows through the EL element in the pixel in the(i+2)-th row, and a light emitting state is reached. In the period D,the electric potential of the gate electrode of the EL driving TFT isreduced, but the electric potential of the source electrode of the ELdriving TFT is also simultaneously reduced. Therefore, the voltagebetween the gate and the source of the EL driving TFT in a period priorto the period C is equal to that in the period D. Even when the ELdriving TFT is in a turned-ON state, the electric potential of thesource electrode of the EL driving TFT is reduced and is lower than theelectric potential of the cathode wiring of the EL element in the periodD so that no electric current flows through the EL element. At the endof the period D, the voltage of the gate signal line in the (i+1)-th rowis returned to the original state. As a result, the electric potentialof the gate electrode of the EL driving TFT in the pixel in the (i+2)-throw is also returned to the original state.

The period E is next started. In the period E, the gate signal line inthe (i+2)-th row is selected. Accordingly, the electric potential of thegate electrode of the EL driving TFT in the pixel in the (i+2)-th rowbecomes the same as the electric potential of the source signal line. Inthe period E, the source signal line is set to a low (L) signal state.Therefore, the electric potential of the gate electrode of the ELdriving TFT in the pixel in the (i+2)-th row becomes the same electricpotential as the source signal line, and also becomes Lo. At that time,one electrode of the holding capacitor, i.e., the electric potential ofthe gate signal line in the (i+1)-th row is already returned to a highstate. Accordingly, the voltage between the gate signal line in the(i+1)-th row and the gate electrode of the EL driving TFT in the pixelin the (i+2)-th row is applied to the holding capacitor so that theabsolute value of the voltage between the gate and the source of the ELdriving TFT is increased. Accordingly, the EL driving TFT in the pixelin the (i+2)-th row attains a turned-ON state, an electric current flowsthrough the EL element in the (i+2)-th row, and light is emitted fromthe EL element. The electric current flowing through the EL element inthe (i+2)-th row is supplied through the gate signal line in the(i+1)-th row.

Next, the period F is started. In the period F, the voltage of the gatesignal line in the (i+2)-th row is returned to the original state, andthe switching TFT in the (i+2)-th row attains a turned-OFF state. Theelectric potential of the gate electrode of the EL driving TFT in thepixel in the (i+2)-th row is held as it is. The electric potential ofthe gate signal line in the (i+1)-th row, i.e., the electric potentialsof the electrode of the holding capacitor in the pixel in the (i+2)-throw and the source electrode of the EL driving TFT are not changed fromtheir present values. Accordingly, hereinafter, the EL driving TFT inthe pixel in the (i+2)-th row attains a turned-ON state, and an electriccurrent continuously flows through the EL element in the (i+2)-th row.

If the above operations are repeatedly performed, an electric current issupplied to the EL element through the gate signal line by connectingthe source electrode of the EL driving TFT 102 and the electrode of theholding capacitor 104 to the gate signal line in another row so that theEL element can be operated.

The polarity of the TFT will next be described.

These polarities are set as in the conventional case in the case of theEL driving TFT. Namely, either an n-channel type TFT or a p-channel typeTFT may be used. However, the p-channel type is desirable inconsideration of source grounding being preferable as the operation of atransistor, a restriction in manufacture of the EL element, etc.

It is necessary to set the polarity for the switching TFT by theelectric potential of the gate signal line. Namely, when the gate signalline and an anode electrode of the EL element are connected to eachother through the EL driving TFT, it is necessary to set the electricpotential of the gate signal line to be higher than that of cathodewiring in order to cause an electric current to flow through the ELelement. Accordingly, it is necessary to use the p-channel type so as toset the gate signal line to have a high electric potential in aturned-OFF state in the switching TFT. On the other hand, if the gatesignal line and a cathode electrode of the EL element are connected toeach other through the EL driving TFT, it is necessary to use then-channel type TFT for the switching TFT.

The present invention can be adapted to each of an analog gray scalesystem and a digital gray scale system.

Embodiments of the present invention will next be described.

Embodiment 1

FIG. 5A shows a circuit constructional example of the entireelectro-optical device in which a pixel portion is arranged at thecenter of this circuit. A circuit diagram of one pixel is a portionsurrounded by a dotted line frame 500 in FIG. 5A. FIG. 5B shows thecircuit diagram. Reference numerals designated within FIG. 5B are thesame as FIG. 1B. A gate signal line side driving circuit for controllingthe operations of gate signal lines 106, 111 is arranged on theleft-hand side of this circuit diagram. When gate signal line sidedriving circuits are symmetrically arranged on both the left-hand andright-hand sides of the pixel portion although this arrangement is notshown, more effective drive can be obtained. A source signal line sidedriving circuit is arranged on the upper side of this circuit diagram tocontrol an operation of the source signal line 105.

A signal inputted to the source signal line 105 may be of digitalquantity of analog quantity. In other words, the present invention canbe applied to the case of digital gray scale and the case of analog grayscale.

The next description relates to a case in which gray scale of k bits(2^(k)) is obtained by combining the digital gray scale and time grayscale. For brevity, gray scale of three bits (2³=8) will be described asan example. FIGS. 6 and 7 show timing charts showing the electricpotentials of the gate signal lines in the rows. A case in which thep-channel type is selected for the polarity of the TFTs for constitutingthe pixel, i.e., for the polarity of both the switching TFT and the ELdriving TFT is taken as an example.

In the construction of the timing chart, first, one frame period isdivided into three subframe periods SF₁ to SF₃. In each of the subframeperiods, there are address (write) periods Ta₁ to Ta₃, and sustain(lighting) periods Ts₁ to Ts₃. Time intervals of the Ts₁ to Ts₃ are setto be changed by power of 2. Namely, Ts₁:Ts₂:Ts₃=4:2:1 is set.

First, a signal is inputted to pixels row by row. In this case, the gatesignal line 106 is selected, and the signal is inputted to the pixelthrough the source signal line 105. This operation is performed from afirst row of the gate signal line to its final row.

Here, the address period is a period from the selection of the gatesignal line in the first row to the selection of the gate signal line inthe final row. Accordingly, the time interval of the address period isthe same during any subframe period.

SF₂ is next started. The gate signal line 106 is similarly selected anda signal is inputted to the pixels through the source signal line 105.This operation is performed from a first row of the gate signal line toits final row.

In the meantime, the electric potential of the cathode wiring 108 isconstant. Therefore, the sustain period of each pixel is defined as aperiod from the time when a signal is written into the pixel in acertain subframe period to the time when a signal is written into thepixel in the next subframe period. Accordingly, timing of the sustainperiod varies in different rows in a certain subframe period, but itstime interval is all the same.

SF₃ is next started. The gate signal line 106 is similarly selected anda signal is inputted to a pixel through the source signal line 105. Inthe SF₃, the address period Ta₃ is longer than the sustain period Ts₃.Therefore, if the period, of Ts₃ is terminated and the address periodTa₁ in the subframe SF₁ in the next frame period is immediately started,gate signal lines in different two rows are simultaneously selected, sothat signals in the two rows can not be normally inputtedsimultaneously. Therefore, after the period of Ts₃ is terminated, theelectric potential of the gate signal line in the precedent row issequentially increased starting from the first row. Namely, the gatesignal line in the precedent row is set to a selected state. Then thevoltage application to the EL elements is sequentially ceased from thepixels in the first row, and the EL elements stop emitting light.However, since gate signal lines in a plurality of rows aresimultaneously selected at this time, a signal is also inputted to anunrelated row. However, in reality, no voltage is applied to the ELelements in the unrelated rows and the EL elements do not emit light.Accordingly, it is not necessary to consider such a case. When theaddress period Ta₃ is terminated and the next address period Ta₁ isstarted, it is returned to the normal operation. Thus, the time intervalof the sustain period Ts₃ can be controlled. A period for setting anon-display period by increasing the electric potential of the gatesignal line in the precedent row is called a clear period (Tc_(n), n: anumber designated to the subframe period).

When the sustain period is shorter than the address period as in theabove, a period from termination of the sustain period to termination ofthe address period or starting of the next address period is set to theclear period. Thus, the time interval of the sustain period can befreely set even when the sustain period is shorter than the addressperiod.

Embodiment 2

In this embodiment, a method of forming TFT of a driving circuit (asource signal line side driving circuit, a gate signal line side drivingcircuit, etc.) arranged in the periphery of the pixel portion, aswitching TFT of the pixel portion and the EL driving TFT on the samesubstrate will be explained step by step in detail as an example of amethod of forming the electro-optical device explained in theembodiment 1. For brevity of the explanation, a CMOS circuit isillustrated as a basic constructional circuit of a driving circuitportion, and the switching TFT and the EL driving TFT are illustrated asthe pixel portion.

First, as shown in FIG. 8A, a base film 5002 formed of an insulatingfilm such as a silicon oxide film, a silicon nitride film or a siliconnitride oxide film is formed on a substrate 5001 formed of glass such asbarium borosilicate glass or alumino borosilicate glass represented by#7059 glass and #1737 glass of CORNING Corporation, etc. For example, asilicon nitride oxide film 5002 a formed from SiH₄, NH₃ and N₂O by theplasma CVD method and having a thickness of from 10 to 200 [nm](preferably 50 to 100 [nm]) is formed. Similarly, a hydrogeneratedsilicon nitride oxide film 5002 b formed from SiH₄ and N₂O and having athickness of from 50 to 200 [nm] (preferably 100 to 150 [nm]) is layeredthereon. In this embodiment, the base film 5002 has a two-layerstructure, but may also be formed as a single layer film of one of theabove insulating films, or a laminate film having more than two layersof the above insulating films.

Island-like semiconductor layers 5003 to 5006 are formed from acrystalline semiconductor film obtained by conducting lasercrystallization or a known thermal crystallization on a semiconductorfilm having an amorphous structure. These island-like semiconductorlayers 5003 to 5006 each have a thickness of from 25 to 80 [nm](preferably 30 to 60 [nm]). No limitation is put on the material of thecrystalline semiconductor film, but the crystalline semiconductor filmis preferably formed from silicon, a silicon germanium (SiGe) alloy,etc.

When the crystalline semiconductor film is to be manufactured by thelaser crystallization method, an excimer laser, a YAG laser and a YVO₄laser of a pulse oscillation type or continuous light emitting type areused. When these lasers are used, it is preferable to use a method inwhich a laser beam radiated from a laser emitting device is convergedinto a linear shape by an optical system and then is irradiated to thesemiconductor film. A crystallization condition is suitably selected byan operator. When the excimer laser is used, pulse oscillation frequencyis set to 30 [Hz], and laser energy density is set to from 100 to 400[mJ/cm²] (typically 200 to 300 [mJ/cm²]. When the YAG laser is used,pulse oscillation frequency is preferably set to from 1 to 10 [kHz] byusing its second harmonic, and laser energy density is preferably set tofrom 300 to 600 [mJ/cm²](typically 350 to 500 [mJ/cm²]). The laser beamconverged into a linear shape and having a width of from 100 to 1000[μm], e.g. 400 [μm] is, is irradiated to the entire substrate face. Atthis time, overlapping ratio of the linear laser beam is set to from 80to 98[%].

Next, a gate insulating film 5007 covering the island-like semiconductorlayers 5003 to 5006 is formed. The gate insulating film 5007 is formedfrom an insulating film containing silicon and having a thickness offrom 40 to 150 [nm] by using the plasma CVD method or a sputteringmethod. In this embodiment, the gate insulating film 5007 is formed froma silicon nitride oxide film of 120 [nm] in thickness. However, the gateinsulating film is not limited to such a silicon nitride oxide film, butit may be an insulating film containing other and having a single layeror a laminated layer structure. For example, when a silicon oxide filmis used, TEOS (Tetraethyl Orthosilicate) and O₂ are mixed by the plasmaCVD method, the reaction pressure is set to 40 [Pa], the substratetemperature is set to from 300 to 400[° C.], and the high frequency(13.56 [MHz]) power density is set to from 0.5 to 0.8 [W/cm²] forelectric discharge. Thus, the silicon oxide film can be formed bydischarge. The silicon oxide film manufactured in this way can thenobtain preferable characteristics as the gate insulating film by thermalannealing at from 400 to 500[° C.].

A first conductive film 5008 and a second conductive film 5009 forforming a gate electrode are formed on the gate insulating film 5007. Inthis embodiment, the first conductive film 5008 having a thickness offrom 50 to 100 [nm] is formed from Ta, and the second conductive film5009 having a thickness of from 100 to 300 [nm] is formed from W.

The Ta film is formed by a sputtering method, and the target of Ta issputtered by Ar. In this case, when suitable amounts of Xe and Kr areadded to Ar, internal stress of the Ta film is released, and pealing offof this film can be prevented. Resistivity of the Ta film of α phase isabout 20 [μΩcm], and this Ta film can be used for the gate electrode.However, resistivity of the Ta film of β phase is about 180 [μΩcm], andis not suitable for the gate electrode. When tantalum nitride having acrystal structure close to that of the α phase of Ta and having athickness of about 10 to 50 [nm] is formed in advance as the base forthe Ta film to form the Ta film of the α phase, the Ta film of α phasecan be easily obtained.

The W film is formed by the sputtering method with W as a target.Further, the W film can be also formed by a thermal CVD method usingtungsten hexafluoride (WF₆). In any case, it is necessary to reduceresistance to use this film as the gate electrode. It is desirable toset resistivity of the W film to be equal to or smaller than 20 [μΩcm].When crystal grains of the W film are increased in size, resistivity ofthe W film can be reduced. However, when there are many impurityelements such as oxygen, etc. within the W film, crystallization isprevented and resistivity is increased. Accordingly, in the case of thesputtering method, a W-target of 99.9999[%] in purity is used, and the Wfilm is formed by taking a sufficient care of not mixing impurities froma gaseous phase into the W film time when the film is to be formed.Thus, a resistivity of from 9 to 20 [μΩcm] can be realized.

In this embodiment, the first conductive film 5008 is formed from Ta,and the second conductive film 5009 is formed from W. However, thepresent invention is not limited to this case. Each of these conductivefilms may also be formed from an element selected from Ta, W, Ti, Mo, Aland Cu, or an alloy material or a compound material having theseelements as principal components. Further, a semiconductor filmrepresented by a polycrystal silicon film doped with an impurity elementsuch as phosphorus may also be used. Examples of combinations other thanthose shown in this embodiment include: a combination in which the firstconductive film 5008 is formed from tantalum nitride (TaN), and thesecond conductive film 5009 is formed from W; a combination in which thefirst conductive film 5008 is formed from tantalum nitride (TaN), andthe second conductive film 5009 is formed from Al; and a combination inwhich the first conductive film 5008 is formed from tantalum nitride(TaN), and the second conductive film 5009 is formed from Cu. It isparticularly preferable to form the first conductive film 5008 and thesecond conductive film 5009 by using a combination that allows for aselection ratio by etching (See FIG. 8A).

Next, a mask 5010 is formed from a resist, and first etching processingfor forming an electrode and wiring is performed. In this embodiment, anICP (Inductively Coupled Plasma) etching method is used, and CF₄ and Cl₂are mixed with a gas for etching. RF (13.56 [MHz]) power of 500 [W] isapplied to the electrode of coil type at a pressure of 1 Pa so thatplasma is generated. RF (13.56 [MHz]) of 100 [W] power is also appliedto a substrate side (sample stage), and a substantially negative selfbias voltage is applied. When CF₄ and Cl₂ are mixed, the W film and theTa film are etched to the same extent.

Under the above etching condition, end portions of a first conductivelayer and a second conductive layer are formed into a tapered shape byeffects of the bias voltage applied to the substrate side by making theshape of the mask formed from the resist into an appropriate shape. Theangle of a taper portion is set to from 15 to 45°. It is preferable toincrease an etching time by a ratio of about 10 to 20[%] so as toperform the etching without leaving the residue on the gate insulatingfilm. Since a selection ratio of a silicon nitride oxide film to the Wfilm ranges from 2 to 4 (typically 3); an exposed face of the siliconnitride oxide film is etched by about 20 to 50 [nm] by over-etchingprocessing. Thus, conductive layers 5011 to 5016 of a first shape (firstconductive layers 5011 a to 5016 a and second conductive layers 5011 bto 5016 b) formed of the first and second conductive layers are formedby the first etching processing. A region that is not covered with theconductive layers 5011 to 5016 of the first shape is etched by about 20to 50 [nm] in the gate insulating film 5007, so that a thinned region isformed.

Then, an impurity element for giving an n-type conductivity is added byperforming first doping processing. A doping method may be either an iondoping method or an ion implantation method. The ion doping method iscarried out under the condition that a dose is set to from 1×10¹³ to5×10¹⁴ [atoms/cm²], and an acceleration voltage is set to from 60 to 100[keV]. An element belonging to group 15, typically, phosphorus (P) orarsenic (As) is used as the impurity element for giving the n-typeconductivity. However, phosphorus (P) is used here. In this case, theconductive layers 5011 to 5015 serve as masks with respect to theimpurity element for giving the n-type conductivity, and first impurityregions 5017 to 5025 are formed in a self-aligning manner. The impurityelement for giving the n-type conductivity is added to the firstimpurity regions 5017 to 5025 in a concentration range from 1×10²⁰ to1×10²¹ [atoms/cm³]. (See FIG. 8B).

Second etching processing is next performed. The ICP etching method issimilarly used, so that CF₄, Cl₂ and O₂ are mixed with an etching gas,and RF power (13.56 [MHz]) of 500 [W] is supplied to the electrode ofcoil type at a pressure of 1 [Pa] to generate plasma. RF (13.56 [MHz])power of 50 [W] is applied to the substrate side (sample stage), and alower self bias voltage is applied in comparison with the self biasvoltage in the first etching processing. Anisotropic etching of a W filmis performed under such a condition, and anisotropic etching of the Tafilm as the first conductive layer is performed at an etching speedslower than that of the anisotropic etching of the W film so thatconductive layers 5026 to 5031 of a second shape (first conductivelayers 5026 a to 5031 a and second conductive layers 5026 b to 5031 b)are formed. A region of the gate insulating film 5007 which is notcovered with the conductive layers 5026 to 5031 of the second shape isfurther etched by about 20 to 50 [nm] so that a thinned region isformed. (See FIG. 8C).

An etching reaction in the etching of the W film using the mixed gas ofCF₄ and Cl₂ and the Ta film can be assumed from the vapor pressure of aradical or ion species generated and a reaction product. When the vaporpressures of a fluoride and a chloride of W and Ta are compared, thevapor pressure of WF₆ as a fluoride of W is extremely high, and vaporpressures of other WCl₅, TaF₅ and TaCl₅ are approximately equal to eachother. Accordingly, both the W film and the Ta film are etched using themixed gas of CF₄ and Cl₂. However, when a suitable amount of O₂ is addedto this mixed gas, CF₄ and O₂ react and become CO and F so that a largeamount of F-radicals or F-ions are generated. As a result, the etchingspeed of the W film whose fluoride has a high vapor pressure isincreased. In contrast to this, the increase in etching speed isrelatively small for the Ta film when F is increased. Since Ta is easilyoxidized in comparison with W, the surface of the Ta film is oxidized byadding O₂. Since no oxide of Ta reacts with fluorine or chloride, theetching speed of the Ta film is further reduced. Accordingly, it ispossible to make a difference in etching speed between the W film andthe Ta film so that the etching speed of the W film can be set to behigher than that of the Ta film.

As shown in FIG. 9A, second doping processing is then performed. In thiscase, an impurity element for giving the n-type conductivity is doped ina smaller dose than in the first doping processing and at a highacceleration voltage by reducing a dose lower than that in the firstdoping processing. For example, the acceleration voltage is set to from70 to 120 [keV], and the dose is set to 1×10¹³ [atoms/cm²]. Thus, a newimpurity region is formed inside the first impurity region formed in theisland-like semiconductor layer in FIG. 8B. In the doping, theconductive layers 5026 to 5030 of the second shape are used as maskswith respect to the impurity element, and the doping is performed suchthat the impurity element is also added to regions underside the firstconductive layers 5026 a to 5030 a. Thus, third impurity regions 5032 to5041 overlapped with the first conductive layers 5026 a to 5030 a, andsecond impurity regions 5042 to 5051 between the first and thirdimpurity regions are formed. The impurity element for giving the n-typeconductivity is doped such that the concentration of the impurityelement ranges from 1×10¹⁷ to 1×10¹⁹ [atoms/cm³] in the second impurityregion, and the concentration of the impurity element ranges from 1×10¹⁶to 1×10¹⁸ [atoms/cm³] in the third impurity region.

As shown in FIG. 9B, fourth impurity regions 5052 to 5074 having aconductivity type reverse to the one conductivity type are formed inisland-like semiconductor layers 5004, 5005, 5006 for forming ap-channel type TFT. The second conductive layers 5012 to 5015 are usedas masks with respect to the impurity element, and the impurity regionsare formed in a self-aligning manner. At this time, the entire faces ofthe island-like semiconductor layer 5003 for forming the n-channel typeTFT, and the second conductive layer 5031 for forming wiring are coveredwith a resist mask 5200 in advance. Phosphorus is added to each ofimpurity regions 5052 to 5054, 5055 to 5057, 5058 to 5060, 5061 to 5065,5066 to 5068, 5069 to 5071, and 5072 to 5074 at differentconcentrations. However, these regions are formed by the ion dopingmethod using diborane (B₂H₆), and the impurity concentration is set tofrom 2×10²⁰ to 2×10²¹ [atoms/cm³] in each of these regions.

The impurity regions are formed in each of the island-like semiconductorlayers through the above steps. The conductive layers 5026 to 5030 ofthe second shape overlapped with the island-like semiconductor layersfunction as the gate electrode. Further, the region 5031 functions as asignal line.

As shown in FIG. 9C, a step of activating the impurity elements added tothe island-like semiconductor layers is performed to control theconductivity type. This process is performed by a thermal annealingmethod using a furnace for furnace annealing. Further, a laser annealingmethod or a rapid thermal annealing method (RTA method) can be applied.In the thermal annealing method, this process is performed at atemperature of from 400 to 700[° C.], typically from 500 to 600[° C.]within a nitrogen atmosphere in which oxygen concentration is equal toor smaller than 1 [ppm] and is preferably equal to or smaller than 0.1[ppm]. In this embodiment, heat treatment is performed for four hours ata temperature of 500[° C.]. When a wiring material used in layers 5026to 5031 is weak against heat, it is preferable to perform activationafter an interlayer insulating film (having silicon as a principalcomponent) is formed in order to protect wiring, etc.

Further, the heat treatment is performed for 1 to 12 hours at atemperature of from 300 to 450[° C.] within an atmosphere including 3 to100[%] of hydrogen so that the island-like semiconductor layer ishydrogenerated. This step is to terminate a dangling bond of thesemiconductor layer by hydrogen thermally excited. Plasmahydrogeneration (using hydrogen excited by plasma) may also be performedas another measure for hydrogeneration.

As shown in FIG. 10A, a first interlayer insulating film 5075 is nextformed. For the first interlayer insulating film 5075, a single layer ofinsulating film containing silicon is used, or a laminate film providedby combining two kinds or more of insulating films containing silicon isused. The film thickness thereof is set to from 400 [nm] to 1.5 [μm]. Inthis embodiment, a silicon oxide nitride film of 200 [nm] in thicknessis formed. An activation may be executed by the furnace annealingmethod, the laser annealing method or a lamp annealing method. In thisembodiment, the heat treatment is performed for four hours at 550[° C.]within a nitrogen atmosphere in an electrothermal furnace.

At this time, the first interlayer insulating film fulfills a functionfor preventing oxidation of the gate electrode.

Further, the heat treatment is performed for 1 to 12 hours at atemperature of from 300 to 450° C. within an atmosphere including 3 to100% of hydrogen, whereby hydrogeneration processing is performed. Thisstep is a process in which a dangling bond of the semiconductor film isterminated by hydrogen thermally excited. Plasma hydrogeneration (usinghydrogen excited by plasma) may also be performed as another measure forhydrogeneration.

When a laminate film is used as the first interlayer insulating film5075, the hydrogeneration processing may also be performed between thestep of forming one layer and the step of forming another layer.

When the activation step is completed, as shown in FIG. 10B, a secondinterlayer insulating film 5076 is formed. Thereafter, contact holes areformed through the first interlayer insulating film 5075, the secondinterlayer insulating film 5076 and the gate insulating film 5007.Wirings (including a connecting electrode) 5077 to 5082, and a gatesignal line 5084 are patterned and formed. Thereafter, a pixel electrode5083 coming in contact with the connecting electrode 5082 is patternedand formed.

A film having an organic resin as a material is used as the secondinterlayer insulating film 5076. Polyimide, polyamide, acrylic, BCB(benzocyclobutene), etc. can be used as this organic resin. Inparticular, since the second interlayer insulating film 5076 is providedmainly for planarization, acrylic excellent in leveling the film ispreferable. In this embodiment, an acrylic film having a thickness thatcan sufficiently level a level difference caused by the TFT is formed.The film thickness thereof is preferably set to from 1 to 5 [μm] (isfurther preferably set to from 2 to 4 [μm]).

In the formation of the contact holes, contact holes reaching n-typeimpurity regions 5018 to 5026 or p-type impurity regions 5054 to 5065, acontact hole reaching wiring 5032, a contact hole reaching an electriccurrent supply line 5033, and unillustrated contact holes reaching gateelectrodes 5029, 5030 are formed by using dry etching or wet etching.

Further, a laminate film of a three-layer structure is patterned in adesired shape and is used as wirings (including a connecting electrodeand a signal line) 5077 to 5082, 5084. In this three-layer structure, aTi film of 100 [nm] in thickness, a Ti-containing aluminum film of 300[nm] in thickness, and a Ti film of 150 [nm] in thickness arecontinuously formed by the sputtering method. However, anotherconductive film may also be used.

When a circuit having a pixel construction of the present invention isconstructed, the gate signal line is formed by utilizing one portion ofthe laminate film of the above three-layer structure, and is also usedas the electric current supply line. Accordingly, a material of lowresistance (e.g., a material having aluminum, copper, etc. as aprincipal component) is desirably used.

In this embodiment, an ITO film of 110 [nm] in thickness is formed as apixel electrode 5083, and is patterned. Contact is made by arranging thepixel electrode 5083 such that this pixel electrode 5083 comes incontact with the connecting electrode 5082 and is overlapped with thisconnecting electrode 5082. Further, a transparent conductive filmprovided by mixing 2 to 20% of zinc oxide (ZnO) with indium oxide mayalso be used. This pixel electrode 5083 becomes an anode of the ELelement.

As shown in FIG. 10B, an insulating film (a silicon oxide film in thisembodiment) containing silicon and having a thickness of 500 [nm] isnext formed. A third interlayer insulating film 5085 is formed in whichan opening is formed in a position corresponding to the pixel electrode5083. When the opening is formed, a side wall of the opening can easilybe tapered by using the wet etching method. When the side wall of theopening is not gentle enough, deterioration of an EL layer caused by alevel difference becomes a notable problem.

Next, an EL layer 5086 and a cathode (MgAg electrode) 5087 arecontinuously formed by using the vacuum evaporation method withoutexposing to the atmosphere. The EL layer 5086 has a thickness of from 80to 200 [nm] (typically from 100 to 120 [nm]), and the cathode 5087 has athickness of from 180 to 300 [nm] (typically from 200 to 250 [nm]).

In this process, the EL layer and the cathode are sequentially formedwith respect to a pixel corresponding to red, a pixel corresponding togreen and a pixel corresponding to blue. In this case, since the ELlayer has an insufficient resistance against a solution, the EL layermust be formed separately for each color instead of using aphotolithography technique. Therefore, it is preferable to cover aportion except for desired pixels using a metal mask so that the ELlayer and the cathode are formed selectively only in a required portion.

Namely, a mask for covering all portions except for the pixelcorresponding to red is first set, and the EL layer and the cathode foremitting red light are selectively formed by using this mask. Next, amask for covering all portions except for the pixel corresponding togreen is set, and the EL layer and the cathode for emitting green lightare selectively formed by using this mask. Next, a mask for covering allportions except for the pixel corresponding to blue is similarly set,and the EL layer and the cathode for emitting blue light are selectivelyformed by using this mask. Here, different masks are used, but insteadthe same single mask may be used repeatedly. It is preferable to performprocessing without breaking a vacuum until the EL layer and the cathodeare formed with respect to all the pixels.

Here, a system for forming three kinds of EL elements corresponding toRGB is used. However, a system in which an EL element for emitting whitelight and a color filter are combined, a system in which the EL elementfor emitting blue or blue green light is combined with a fluorescentsubstance (a fluorescent color converting layer: CCM), a system foroverlapping the EL elements respectively corresponding to R, G, and Bwith the cathodes (opposite electrodes) by utilizing a transparentelectrode, etc. may be used.

A known material can be used as the EL layer 5086. An organic materialis preferably used as the known material in consideration of a drivingvoltage. For example, a four-layer structure consisting of a holeinjection layer, a hole transportation layer, a light emitting layer andan electron injection layer is preferably used for the EL layer. In thisembodiment, an MgAg electrode is used as the cathode of the EL elementas an example, but another known material may also be used.

Next, a protective electrode 5088 is formed so as to cover the EL layerand the cathode. An conductive film having aluminum as a principalcomponent is used as this protective electrode 5088. The protectiveelectrode 5088 is formed by the vacuum evaporation method using a maskdifferent from the one used when the EL layer and the cathode areformed. After the EL layer and the cathode are formed, the protectiveelectrode 5088 is preferably formed continuously without exposing theformed films to the atmosphere.

Finally, a passivation film 5089 formed of a silicon nitride film andhaving a thickness of 300 [nm] is formed. In reality, the protectivefilm 5088 plays a role of protecting the EL layer from moisture, etc.However, reliability of the EL element can be further improved byforming the passivation film 5089.

Thus, an active matrix type electro-optical device having a structure asthe one shown in FIG. 10B is completed. In FIG. 10B, portions indicatedby A-A′ and B-B′ correspond to A-A′ and B-B′ sections in FIG. 1A,respectively.

In the process of forming the active matrix type electro-optical devicein this embodiment, the source signal line is formed from Ta and W thatare materials of the gate electrodes, and the gate signal line is formedfrom Al that is a wiring material of the source and drain electrodes forconveniences of the circuit construction and procedures in the process.However, different materials may also be used.

The active matrix type electro-optical device in this embodiment hasvery high reliability and improved operating characteristics byarranging the TFTs of the optimal structures in a driving circuitportion in addition to the pixel portion. Further, in a crystallizationprocess, crystallinity can be also improved by adding a metal catalystsuch as Ni. Thus, a driving frequency of the source signal line drivingcircuit can be set to 10 [MHz] or more.

First, the TFT having a structure for reducing hot carrier injection soas not to reduce an operating speed as much as possible is used as ann-channel type TFT of a CMOS circuit forming the driving circuitportion. Here, the driving circuit includes a shift register, a buffer,a level shifter, a latch in line sequential driving, a transmission gatein dot sequential driving, etc.

In the case of this embodiment, an active layer of the n-channel typeTFT includes a source region, a drain region, a GOLD region, an LDDregion and a channel forming region. The GOLD region is overlapped withthe gate electrode through the gate insulating film.

Deterioration by the hot carrier injection in the p-channel type TFT ofthe CMOS circuit is almost neglectible. Therefore, it is not necessaryto particularly form the LDD region in this p-channel type TFT. However,similar to the n-channel type TFT, the LDD region can be formed as a hotcarrier countermeasure.

Further, when the CMOS circuit for bidirectionally flowing an electriccurrent through a channel forming region, i.e., the CMOS circuit inwhich roles of the source and drain regions are exchanged is used in thedriving circuit, it is preferable for the n-channel type TFT thatconstitutes the CMOS circuit to form LDD regions such that the channelforming region is sandwiched between the LDD regions. As an example ofthis, a transmission gate used in the dot sequential driving is given.When a CMOS circuit required to reduce an OFF-state current value asmuch as possible is used in the driving circuit, the n-channel type TFTforming the CMOS circuit preferably has a construction in which the LDDregion is partially overlapped with the gate electrode through the gateinsulating film. The transmission gate used in the dot sequentialdriving can be given also as an example of the TFT as such.

In reality, when the electro-optical device reaches the state of FIG.10B, it is preferable to perform packaging (sealing) using a protectivefilm (a laminate film, an ultraviolet curable resin film, etc.) that hasa high airtight seal property and allows little degasification and atranslucent sealing member in order to prevent the EL element from beingexposed to the outside air. In this case, reliability of the EL elementis improved by filling the interior of the sealing member with an inertgas atmosphere and arranging a moisture absorbing material (e.g., bariumoxide) therein.

Further, after the airtight seal property is improved by processing ofpackaging, etc., a connector (flexible printed circuit: FPC) is attachedto complete the device as a product. The connector is for connecting,with an external signal terminal, a terminal led out from the element orthe circuit which is formed on the substrate. The device in this stateis ready to be shipped and is called an EL display (or EL module) inthis specification.

Embodiment 3

In this embodiment, a manufacturing example of the electro-opticaldevice of the present invention will be explained.

FIG. 11A is a top view of the electro-optical device using the presentinvention. FIG. 11B shows a cross-sectional view cut by the X-X′ planeof FIG. 11A. In FIG. 11A, reference numerals 4001, 4002, 4003 and 4004respectively designate a substrate, a pixel portion, a source signalline side driving circuit and a gate signal line side driving circuit.The respective driving circuits reach an FPC 4008 via wirings 4005,4006, 4007 and are connected to an external device.

At this time, a cover member 4009, a sealant 4010 and a sealing member(also called a housing member) 4011 (shown in FIG. 11B) are arrangedsuch that these members surround at least the pixel portion, preferablythe driving circuits and the pixel portion.

FIG. 11B shows a sectional structure of the electro-optical device inthis embodiment. A TFT 4013 for the driving circuits (a CMOS circuitobtained by combining the n-channel TFT and the p-channel TFT isillustrated here) and a TFT 4014 for the pixel portion (only an ELdriving TFT for controlling an electric current to the EL element isillustrated here) are formed on the substrate 4001 and a base film 4012.A known structure (a top gate structure or a bottom gate structure) isused in these TFTs.

When the TFT 4013 for the driving circuits and the TFT 4014 for thepixel portion are completed by using a known manufacturing method, apixel electrode 4016 electrically connected to a drain of the TFT 4014for the pixel portion is formed from a transparent conductive film on aninterlayer insulating film (leveling film) 4015 formed of a resinmaterial. A compound (called an ITO) of indium oxide and tin oxide or acompound of indium oxide and zinc oxide can be used as the transparentconductive film. After the pixel electrode 4016 is formed, an insulatingfilm 4017 is formed and an opening is formed on the pixel electrode4016.

An EL layer 4018 is next formed. The EL layer 4018 may be a single layerstructure film of a known EL material (a hole injection layer, a holetransportation layer, a light emitting layer, an electron transportationlayer or an electron injection layer), or may be a laminate structurefilm of any combination of known EL materials. The structure of the ELlayer 4018 is determined by using a known technique. EL materials aredivided into monomer-based materials and polymer-based materials in theEL material. When the monomer-based material is used, the evaporationmethod is used. On the other hand, when the polymer-based material isused, a simple method such as a spin coat method, a printing method oran ink jet method can be used.

In this embodiment, the EL layer is formed by the evaporation methodusing a shadow mask. Color display can be performed by forming a lightemitting layer (a red light emitting layer, a green light emitting layerand a blue light emitting layer) in which different wavelengths of lightis emitted for different groups of pixels by using the shadow mask. Inaddition to this, there are a system in which a color converting layer(CCM) and a color filter are combined, and a system in which a whitelight emitting layer is combined with a color filter, and any method ofthese systems may also be used. Further, it is also possible toconstruct an electro-optical device for emitting monochromatic light.

After the EL layer 4018 is formed, a cathode 4019 is formed on the ELlayer 4018. It is desirable to remove moisture and oxygen existing on aninterface of the cathode 4019 and the EL layer 4018 as much as possible.Accordingly, it is necessary to take a measure in which the EL layer4018 and the cathode 4019 are continuously formed in vacuum, or ameasure in which the EL layer 4018 is formed in an inert gas atmosphereand then the cathode 4019 is formed without exposing the films to theatmosphere. In this embodiment, the above film formation can beperformed by using a film forming apparatus of multi-chamber system(cluster tool system).

In this embodiment, a laminating structure of a LiF (lithium fluoride)film and an Al (aluminum) film is used as the cathode 4019. Concretely,the LiF (lithium fluoride) film of 1 [nm] in thickness is formed on theEL layer 4018 by the evaporation method, and the aluminum film of 300[nm] in thickness is formed on the LiF film. The MgAg electrode that isa known cathode material may also be used. The cathode 4019 is connectedto wiring 4007 in a region denoted by reference numeral 4020. The wiring4007 is a power line for giving a predetermined voltage to the cathode4019, and is connected to the FPC 4008 through an conductive pastematerial 4021.

It is necessary to form a contact hole through the interlayer insulatingfilm 4015 and the insulating film 4017 in order to electrically connectthe cathode 4019 and the wiring 4007 in the region denoted by referencenumeral 4020. These holes may be formed the time of etching theinterlayer insulating film 4015 (when forming the contact hole for thepixel electrode), or at the time of etching the insulating film 4017(when forming an opening before the formation of the EL layer).Alternatively, the contact hole may be formed when the insulating film4017 is etched by etching the insulating film 4017 until it reaches tothe inter layer insulating film 4015. In this case, if the interlayerinsulating film 4015 and the insulating film 4017 are formed of the sameresin material, the contact hole can have a preferable shape.

The passivation film 4022, a filler 4023 and the cover member 4009 areformed so as to cover the surface of the EL element formed in this way.

Further, a sealing member 4011 is arranged between the cover member 4009and the substrate 4001 so as to surround the EL element portion.Further, a sealant (second sealing member) 4010 is formed outside thesealing member 4011.

At this time, this filler 4023 also functions as an adhesive foradhering the cover member 4009. PVC (polyvinyl chloride), epoxy resin,silicone resin, PVB (polyvinyl butyral) or EVA (ethylenevinyl acetate)can be used as the filler 4023. When a drying agent is arranged withinthis filler 4023, a moisture absorbing effect can be maintained, whichis preferable. Deterioration of the EL layer may be suppressed also byarranging an anti-oxidizer having effects of capturing oxygen, etc.within the filler 4023.

Further, a spacer may also be included within the filler 4023. At thistime, the spacer may be formed from a granular substance comprised ofBaO, etc., so that the spacer itself can have a moisture absorbingproperty.

When the spacer is arranged, the passivation film 4022 can release aspacer pressure. Further, a resin film for releasing the spacer pressuremay also be arranged separately from the passivation film.

A glass plate, an aluminum plate, a stainless steel plate, an FRP(Fiberglass-Reinforced Plastics) plate, a PVF (polyvinyl fluoride) film,a Mylar film, a polyester film or an acrylic film can be used as thecover member 4009. When the PVB or the EVA is used as the filler 4023,it is preferable to use a sheet having a structure in which an aluminumfoil of several ten [μm] in thickness is sandwiched between the PVFfilms or the Mylar films.

In this case, the cover member 4009 may have to be light transmissivedepending on a light emitting direction (a light radiating direction)from the EL element.

The wiring 4007 is electrically connected to the FPC 4008 through thegap between the sealing member 4011 and the substrate 4001, and the gapebetween the sealant 4010 and the substrate 4001. Here, the wiring 4007is explained, but other wirings 4005, 4006 are similarly electricallyconnected to the FPC 4008 through portions below the sealing member 4011and the sealant 4010.

In this embodiment, the filler 4023 is arranged, and then the covermember 4009 is adhered and the sealing member 4011 is attached so as tocover the side faces (exposed faces) of the filler 4023. However, thefiller 4023 may also be arranged after the cover member 4009 and thesealing member 4011 are attached. In this case, a filler injection portcommunicated with the gap between the substrate 4001 and the covermember 4009 and the gape between the substrate 4001 and the sealingmember 4011 is formed. These gaps are brought into a vacuum state (equalto or smaller than 10⁻² [Torr]), and the injecting port is dipped into areservoir filled with the filler. Thereafter, the atmospheric pressureoutside the gaps is set to be higher than the atmospheric pressureinside the gaps, so that the gaps are filled with the filler.

Embodiment 4

In this embodiment, an example in which an electro-optical devicedifferent from Embodiment 3 is manufactured, is described with referenceto FIGS. 12(A) and 12(B). Since the same reference numerals as those inFIGS. 11(A) and 11(B) denote the same portions, an explanation isomitted.

FIG. 12A is a top view of an electro-optical display device of thisembodiment. FIG. 12B is a sectional view of the electro-optical displaydevice taken along line A-A′ of FIG. 12A.

In accordance with Embodiment 3, steps are carried out until apassivation film 4022 covering the surface of an EL element is formed.

Further, a filler 4023 is provided so as to cover the EL element. Thisfiller 4023 functions also as an adhesive for bonding a cover member4009. As the filler 4023, PVC (polyvinyl chloride), epoxy resin,silicone resin, PVB (polyvinyl butyral) or EVA (ethylene-vinyl acetate)can be used. It is preferable that a drying agent is provided in theinside of this filler 4023, since a moisture absorption effect can beheld. It is also preferable that antioxidant or the like which cancapture oxygen, is provided in the inside of this filler 4023, sincedeterioration of the EL layer can be prevented.

A spacer may be contained in the filler 4023. At this time, the spaceris a granular material made of BaO or the like, thereby the spaceritself may be made to have a moisture absorption property.

In the case where the spacer is provided, the passivation film 4022 canrelieve spacer pressure. In addition to the passivation film, a resinfilm or the like for relieving the spacer pressure may be provided.

As the cover member 4009, a glass plate, an aluminum plate, a stainlessplate, an FRP (Fiberglass-Reinforced Plastics) plate, a PVF (polyvinylfluoride) film, a Mylar film, a polyester film, or an acrylic film canbe used. In the case where PVB or EVA is used for the filler 4023, it ispreferable to use a sheet of a structure in which an aluminum foil ofseveral tens of [μm] is interposed between PVF films or Mylar films.

However, according to the direction of light emission (radiationdirection of light) from the EL element, it is necessary that the covermember 6000 has transparency.

Next, after the cover member 4009 is bonded by using the filler 4023, aframe member 4024 is attached so as to cover the side (exposed surface)of the filler 4023. The frame member 4024 is bonded by a sealing member(functioning as an adhesive) 4025. At this time, as the sealing member4025, although it is preferable to use a photo-curing resin, if heatresistance of the EL layer permits, a thermosetting resin may be used.Incidentally, it is desirable that the sealing member 4025 is a materialwhich is as impermeable as possible to moisture and oxygen. A dryingagent may be added in the inside of the sealing member 4025.

Further a wiring 4007 is electrically connected to an FPC 4008 through agap between the sealing member 4025 and a substrate 4001. Here, althoughdescription is made on the wiring 4007, other wirings 4005 and 4006 arealso electrically connected to the FPC 4008 through a space under thesealing member 4025 in the same manner.

In Embodiment 4, the cover member 4009 is bonded after forming thefiller 4023, and the frame member 4024 is attached so as to cover theside surfaces (exposed surfaces) of the filler 4023, but the filler 4023may also be formed after attaching the cover member 4009, sealing member4025, and the frame member 4024. In this case, a filler injectionopening is formed through a gap formed by the substrate 4001, the covermember 4009, sealing member 4025 and the frame member 4024. The gap isset into a vacuum state (a pressure equal to or less than 10⁻² Torr),and after immersing the injection opening in the tank holding thefiller, the air pressure outside of the gap is made higher than the airpressure within the gap, and the filler fills the gap.

Embodiment 5

Here, a more detailed sectional structure of a pixel portion of anelectro-optical display device is shown in FIG. 13.

In FIG. 13, a switching TFT 4502 provided on a substrate 4501 is formedby using an n-channel TFT formed by a known method. In this embodiment,although a double gate structure is used, since there is no bigdifference in the structure and fabricating process, explanation isomitted. However, a structure in which two TFTs are substantiallyconnected in series with each other is obtained by adopting the doublegate structure, and there is a merit that an off current value can bedecreased. Incidentally, although the double gate structure is adoptedin this embodiment, a single gate structure may be adopted, or a triplegate structure or a multi-gate structure having more gates may beadopted. Further, it may be formed by using a p-channel TFT formed by aknown method.

Further, an EL driving TFT 4503 is formed by using an n-channel TFTformed by a known method. A drain wiring 4504 of the switching TFT 4502is electrically connected to a gate electrode 4506 of the EL driving TFT4503 through a wiring 4505. A wiring designated by reference numeral4507 is a gate wiring for electrically connecting gate electrodes 4508and 4509 of the switching TFT 4502.

Since the EL driving TFT 4503 is an element for controlling the amountof current flowing through an EL element 4510, a large current flows andit is an element having high fear of deterioration due to heat ordeterioration due to hot carriers. Thus, it is very effective to adopt astructure in which an LDD region is provided at a drain side of the ELdriving TFT 4503 so as to overlap with a gate electrode through a gateinsulating film.

In this embodiment, although the EL driving TFT 4503 is shown as asingle gate structure, a multi-gate structure in which a plurality ofTFTs are connected in series with each other may be adopted. Further,such a structure may be adopted that a plurality of TFTs are connectedin parallel with each other to substantially divide a channel formingregion into plural portions, so that radiation of heat can be made athigh efficiency. Such structure is effective as a countermeasure againstdeterioration due to heat.

Further, the wiring including the gate electrode 4506 of the EL drivingTFT 4503 overlaps with a drain wiring 4512 of the EL driving TFT 4503through an insulating film, and a storage capacitor is formed in theregion. The storage capacitor functions to store a voltage applied tothe gate electrode 4506 of the EL driving TFT 4503.

A first interlayer insulating film 4514 is provided on the switching TFT4502 and the EL driving TFT 4503, and a second insulating film made ofan organic resin is formed thereon.

Reference numeral 4517 designates a pixel electrode (cathode of the ELelement) made of a conductive film having high reflectivity. The pixelelectrode is partly formed to overlap with a drain region of the ELdriving TFT 4503 and electrically connected to the drain region. As thepixel electrode 4517, it is preferable to use a low resistanceconductive film, such as an aluminum alloy film, a copper alloy film ora silver alloy film, or a lamination film of those. Of course, alaminate structure with another conductive film may be adopted.

Then, an organic resin film 4516 is formed on a pixel electrode 4517 andthe flattening film 4516 is patterned to form an EL layer 4519. Herein,although not shown in figure, light-emitting layers corresponding toeach color of R (red), G (green), and B (blue) may be formed. As anorganic material used for the light-emitting layer, a π-conjugatepolymer material is used. Typical examples of the polymer materialinclude polyparaphenylene vinylene (PPV), polyvinyl carbazole (PVK), andpolyfluorene.

Although various types exist as the PPV typed organic EL material, forexample, a material as disclosed in “H. Shenk, H. Becker, O GOLEDsen, E.Kluge, W. Kreuder, and H. Spreitzer, “Polymers for Light EmittingDiodes”, Euro Display, Proceedings, 1999, p. 33-37” or Japanese PatentApplication Laid-open No. Hei. 10-92576 may be used.

As a specific light emitting layer, it is appropriate thatcyanopolyphenylene-vinylene is used for a light emitting layer emittingred light, polyphenylenevinylene is used for a light emitting layeremitting green light, and polyphenylenevinylene or polyalkylphenyene isused for a light emitting layer emitting blue light. It is appropriatethat the film thickness is made 30 to 150 nm (preferably 40 to 100 nm).

However, the above examples are an example of the organic material whichcan be used for the light emitting layer, and it is not necessary tolimit the invention to these. The EL layer (layer in which lightemission and movement of carriers for that are performed) may be formedby freely combining a light emitting layer, a charge transporting layerand a charge injecting layer.

For example, although this embodiment shows the example in which thepolymer material is used for the light emitting layer, a low molecularorganic material may be used. It is also possible to use an inorganicmaterial, such as silicon carbide, as the charge transporting layer orthe charge injecting layer. As the EL material or inorganic material, awell-known material can be used.

At the point when the anode 4523 was formed, an EL element 4510 iscompleted. Incidentally, the EL element 4510 here indicates a storagecapacitor formed of the pixel electrode (cathode) 4517, the lightemitting layer 4519, the hole injecting layer 4522 and the anode 4523.

In this embodiment, a passivation film 4524 is further provided on theanode 4523. As the passivation film 4524, a silicon nitride film or asilicon nitride oxide film is desirable. This object is to insulate theEL element from the outside, and has both meaning of preventingdeterioration due to oxidation of the organic EL material andsuppressing degassing from organic EL material. By doing this, thereliability of the electro-optical display device is improved.

As described above, the electro-optical device described in theEmbodiment 5 includes the pixel portion comprising the pixel having thestructure as shown in FIG. 13, and includes the switching TFT having asufficiently low off current value and the EL driving TFT resistant tohot carrier injection. Thus, it is possible to obtain theelectro-optical display which has high reliability and can makeexcellent image display.

In the case of an EL element having the structure described inEmbodiment 5, light generated in the light emitting layer 4519 isradiated to the substrate on which TFTs are formed as indicated by anarrow.

Embodiment 6

In this embodiment, a description will be made on a structure in whichthe structure of the EL element 4510 is inverted in the pixel portionshown in Embodiment 5. FIG. 14 is used for the description.Incidentally, points different from the structure of FIG. 13 are only aportion of an EL element and a TFT portion, the other explanation isomitted.

In FIG. 12, a switching TFT 4502 is formed by using a p-channel TFTformed by a known method. An EL driving TFT 4503 is formed by using ap-channel TFT formed by a known method. Herein, it is desirable to usethe same polarity for the switching TFT and the EL driving TFT.

In this embodiment, a transparent conductive film is used as a pixelelectrode (anode) 4525. Specifically, a conductive film made of acompound of indium oxide and zinc oxide is used. Of course, a conductivefilm made of a compound of indium oxide and tin oxide may be used.

After a third interlayer insulating film made of an organic film isformed, a light emitting layer 4528 is formed. An electron injectinglayer 4529 made of potassium acetylacetonate (expressed as acacK), and acathode 4530 made of aluminum alloy are formed thereon.

Thereafter, as described in the Embodiment 5, a passivation film 4532 isformed to prevent oxidation of the organic EL material, thereby an ELelement 4531 is formed.

In the case of an EL element having the structure described inEmbodiment 6, light generated in the light emitting layer 4528 isradiated to the substrate on which TFTs are formed as indicated by anarrow.

Embodiment 7

In this embodiment, a driving method different from that in theEmbodiment 1 is combined with the electro-optical device of the presentinvention. This embodiment is explained with reference to FIGS. 16A to17B.

Here, for brevity, gray scale of three bits (2³=8 gray scales) isobtained by combining digital gray scale and time gray scale. FIGS. 16Aand 16B show timing charts of this construction. One frame period isdivided into three subframe periods SF₁ to SF₃. Each time interval ofthe subframe periods SF₁ to SF₃ is determined by power of 2. Namely, inthis case, SF₁:SF₂:SF₃=4:2:1 (2²:2¹:2⁰) is set.

First, a signal is inputted to pixels stage by stage in a first subframeperiod. In this case, a gate signal line is actually selected only in asubgate signal line selecting period of the first half. In a subgatesignal line selecting period of the latter half, no gate signal line isselected, and no signal is inputted to a pixel. This operation isrepeatedly performed from a first stage to a final stage. Here, anaddress period is a period from the selection of the gate signal line atthe first stage to the selection of the gate signal line at the finalstage. Accordingly, a time interval of the address period is the same inany subframe period.

Subsequently, a second subframe period is started. A signal is similarlyinputted to pixels stage by stage. In this case also, the gate signalline is selected only in the subgate signal line selecting period of thefirst half. This operation is repeatedly performed from the first stageto the final stage.

At this time, a constant voltage is applied to the cathode wiring ofeach pixel. Accordingly, a sustain (lighting) period of a pixel in acertain subframe period is defined as a period from the writing of asignal into the pixel in a certain subframe period to start of writingof the signal to a pixel in the next subframe period. Accordingly, thesustain period is different in timing for different stages, but is equalin time interval.

Subsequently, a third subframe period will be explained. First, similarto the first and second subframe periods, the gate signal line isselected in the subgate signal line selecting period of the first half,and a signal is written into a pixel. In this case, when a signal beginsto be written into a pixel near the final stage, a writing period of thesignal into the pixel at the first stage in the next frame period, i.e.,the address period is already started. As a result, writing of thesignal into the pixel near the final stage in the third subframe periodis overlapped with writing of the signal to a certain pixel in the firsthalf of the first subframe period of the next frame period. It isimpossible to write simultaneously different signals of two stagesnormally into pixels of two different stages. Therefore, in the thirdsubframe period, the gate signal line is selected in the subgate signalline selecting period of the latter half. Accordingly, in the firstsubframe period (this subframe period belongs to the next frame period),the gate signal line is selected in the subgate signal line selectingperiod of the first half so that simultaneous writing of signals intodifferent pixels of two stages can be avoided.

As mentioned above, in the driving method of the present invention, whenan address period in a certain subframe period is overlapped with anaddress period in another subframe period, a writing period is allocatedby utilizing a plurality of subgate signal line selecting periods. Thus,it is possible to prevent timings of selecting the gate signal linesfrom being actually overlapped. As a result, a signal can be normallywritten into a pixel.

FIG. 17A shows a circuit constructional example for embodying thedriving method of this embodiment. A pixel portion has a structure ofthe electro-optical device of the present invention.

In FIG. 17A, the pixel portion is arranged in the center of thisstructure. A source signal line side driving circuit for controlling theoperation of a source signal line is arranged above the pixel portion. Apair of gate signal line side driving circuits for controlling theoperation of a gate signal line are arranged such that one is on theleft and the other is to the right of the pixel portion. A first gatesignal line side driving circuit selects the gate signal line in thesubgate signal line selecting period of the first half, and a secondgate signal line side driving circuit selects the gate signal line inthe subgate signal line selecting period of the latter half.

FIG. 17B shows an enlarged view of one pixel portion indicated by adotted line frame in FIG. 17A. Reference numerals 1701, 1702 and 1703respectively designate a first switching TFT, a second switching TFT,and an EL driving TFT. Reference numerals 1704, 1705 and 1706respectively designate an EL element, a holding capacitor and a sourcesignal line. Reference numerals 1707, 1708 and 1709 respectivelydesignate a first gate signal line in an i-th row selected by the firstgate signal line side driving circuit, a second gate signal line in thei-th row selected by the second gate signal line side driving circuit,and a cathode electrode. Reference numerals 1710, 1711 and 1712respectively designate an anode of the EL element, a cathode of the ELelement, and a third gate signal line functioning as an electric currentsupply line to the EL element 1704. As mentioned above, it is notnecessary for the third gate signal line 1712 to be a gate signal linein a precedent adjacent row. However, for brevity, given here is anexample in which the connection is made to the gate signal line in theprecedent adjacent row.

When the gate signal line is selected in the subgate signal lineselecting period of the first half, a selecting pulse from the firstgate signal line side driving circuit is inputted from the first gatesignal line 1707 in the address period, and the first switching TFT 1601attains a turned-ON state. Thereafter, the EL driving TFT 1703 attains aturned-ON state in the sustain period, and an electric current suppliedfrom the third gate signal line 1712 flows to the EL element 1704. Thus,light is emitted from the EL element 1704 only for a period in which theholding capacitor 1705 holds electric charges applied to the gateelectrode of the EL driving TFT 1703.

When the gate signal line is selected in the subgate signal lineselecting period of the latter half, a selecting pulse from the secondgate signal side driving circuit is inputted from the second gate signalline 1708 in the address period, and the second switching TFT 1602attains a turned-ON state. Thereafter, the EL driving TFT 1703 attains aturned-ON state in the sustain period, and an electric current suppliedfrom the third gate signal line 1712 flows to the EL element 1704. Thus,light is emitted from the EL element 1704 only for a period in which theholding capacitor 1705 holds electric charges applied to the gateelectrode of the EL driving TFT 1703.

Thus, the pixel of the present invention can be used in combination withvarious driving methods.

Each of TFTs 1701, 1702, 1703 in FIG. 17B is a single gate TFT here.However, in this embodiment, a double gate type and a multi-gate typehaving more than two gate electrodes may also be used. The polarity ofthe TFT may be determined in conformity with the structure of the ELelement, etc.

Embodiment 8

In this embodiment, a driving method for setting a non-display periodbrought by the clear period in the embodiment 1 by a method differentfrom that in the embodiment 1 is combined with the electro-opticaldevice of the present invention. This explanation is made with referenceto FIGS. 18A to 19B.

FIG. 18A is a timing chart showing an electric potential of the gatesignal line when the driving method in this embodiment is executed.Since timing of selecting the gate signal line in each subframe periodis similar to that in the embodiment 1, its explanation is omitted here.

In the embodiment 1, the non-display period (clear period) is set byincreasing the electric potential of the gate signal line functioning asthe electric current supply line to avoid overlapping of the sustainperiod Ts₃ and the address period Ta₁ in the next row. In contrast tothis, in this embodiment, the non-display period similar to that in theembodiment 1 is set by inputting a reset signal by using a dedicatedsignal line. Here, this period is called a reset period (Tr_(n), n: anumber designated to the subframe period).

FIG. 19A shows a circuit constructional example for embodying thedriving method of this embodiment. The pixel portion has the structureof the electro-optical device of the present invention.

In FIG. 19A, the pixel portion is arranged in the center of thisstructure. A source signal line side driving circuit for controlling theoperation of a source signal line is arranged above the pixel portion. Agate signal line side driving circuit for controlling the operation of agate signal line is arranged to the left of the pixel portion. If thegate signal line side driving circuit is arranged on each of the leftand the right to a pixel array, although this arrangement is notillustrated, more effective driving can be obtained. The gate signalline side driving circuit in this embodiment has a circuit (not shown)for outputting a reset signal.

FIG. 19B shows an enlarged view of one pixel portion indicated by adotted line frame in FIG. 19A. Reference numerals 1901, 1902 and 1903respectively designate a switching TFT, an EL driving TFT and an ELelement. Reference numerals 1904, 1905 and 1906 respectively designate aholding capacitor, a resetting TFT and a source signal line. Referencenumerals 1907, 1908 and 1909 respectively designate a first gate signalin an i-th row, a cathode electrode and an anode of the EL element.Reference numerals 1910, 1911 and 1912 respectively designate a cathodeof the EL element, a second gate signal line functioning as an electriccurrent supply line for the EL element 1903, and a reset signal line forinputting the reset signal. As mentioned above, it is not necessary forthe second gate signal line 1911 to be a gate signal line in a precedentadjacent row. However, for brevity, given as an example is a case inwhich the connection is made to the gate signal line in the precedentadjacent row.

A selecting pulse from the gate signal line side driving circuit isinputted from the first gate signal line 1907, and the switching TFT1901 attains a turned-ON state. Thereafter, the EL driving TFT 1902attains a turned-ON state in the sustain period, and an electric currentsupplied from the second gate signal line 1911 flows to the EL element1903. Thus, light is emitted from the EL element 1903 only for a periodin which the holding capacitor 1904 holds electric charges applied tothe gate electrode of the EL driving TFT 1902.

Here, in FIG. 18B, a reset signal is inputted from the reset signal line1912 in a reset period to avoid overlapping of the sustain period Ts₃and the address period Ta₁, and the TFT 1905 for reset attains aturned-ON state and frees the electric charges held in the holdingcapacitor 1904. Accordingly, the supply of the electric current to theEL element is stopped in this period, and the EL element stops emittinglight.

Similar to the embodiment 1, overlapping of the address period and thesustain period is avoided and an image can be normally displayed bysetting the non-lighting period in this manner.

The electro-optical device of the present invention can be easilyapplied also when the circuit as shown in this embodiment is used.

Each of TFTs 1901, 1902 and 1905 in FIG. 19B is a single gate TFT here,but a double gate type and a multi-gate type having more than two gateelectrodes may also be used in this embodiment. Polarities of the TFTmay be determined in conformity with the structure of the EL element,etc.

Embodiment 9

In this embodiment, a driving method for setting the non-display periodbrought by using the reset signal in the embodiment 8 by a methoddifferent from that in the embodiment 8 is combined with theelectro-optical device of the present invention. This explanation ismade with reference to FIGS. 20A and 20B.

FIG. 20A shows a circuit constructional example for embodying thedriving method of this embodiment. The pixel portion has the structureof the electro-optical device of the present invention.

In FIG. 20A, the pixel portion is arranged in the center of thisstructure. A source signal line side driving circuit for controlling theoperation of a source signal line is arranged above the pixel portion. Agate signal line side driving circuit for controlling the operation of agate signal line is arranged to the left of the pixel portion. If thegate signal line side driving circuit is arranged on each of the leftand the right of a pixel array although this arrangement is notillustrated, more effective driving can be obtained. The gate signalline side driving circuit in this embodiment has a circuit (not shown)for outputting a reset signal.

FIG. 20B shows an enlarged view of one pixel portion indicated by adotted line frame in FIG. 20A. Reference numerals 2001, 2002 and 2003respectively designate a switching TFT, an EL driving TFT and an ELelement. Reference numerals 2004, 2005 and 2006 respectively designate aholding capacitor, a resetting TFT and a source signal line. Referencenumerals 2007, 2008 and 2009 respectively designate a first gate signalline in an i-th row, a cathode electrode and an anode of the EL element.Reference numerals 2010, 2011 and 2012 respectively designate a cathodeof the EL element, a second gate signal line functioning as an electriccurrent supply line for the EL element 2003, and a reset signal line forinputting the reset signal. As mentioned above, it is not necessary forthe second gate signal line 2001 to be a gate signal line in a precedentadjacent row. However, for brevity, given as an example is a case inwhich the connection is made to the gate signal line in the precedentadjacent row.

Since the driving method of the circuit shown in this embodiment issimilar to that in the embodiment 8, it is sufficient to refer to FIGS.8 A and 8B. Accordingly, the explanation on the method is omitted here.In the embodiment 8, the reset period is obtained by inputting a resetsignal to bring the resetting TFT to a turned-ON so that the electriccharges in the holding capacitor are freed. In contrast to this, in thisembodiment, the TFT 2005 for reset is arranged between the second gatesignal line 2011 that is the electric current supply line and the ELdriving TFT 2002. In the normal sustain period, the resetting TFT is ina turned-ON state, and an electric current supplied from the second gatesignal line 2011 flows to the EL element 2003 through the EL driving TFT2002. When the reset signal is inputted to the reset signal line 2012 inthe reset period, the TFT 2005 for reset attains a turned-OFF state, andthe supply of the electric current to the EL element is interrupted.Thus, a non-display period is set.

Similar to the embodiments 1 and 8, overlapping of the address periodand the sustain period is avoided and an image can be normally displayedby setting a non-lighting period in this manner.

The electro-optical device of the present invention can be easilyapplied also when the circuit as shown in this embodiment is used.

Each of TFTs 2001, 2002 and 2005 in FIG. 20B is a single gate TFT here,but a double gate type and a multi-gate type having more than two gateelectrodes may also be used in this embodiment. Polarities of the TFTmay be determined in conformity with the structure of the EL element,etc.

Embodiment 10

In this embodiment, a driving method different from those in theembodiments 1 and 7 to 9 is combined with a pixel of the presentinvention. A circuit construction is similar to that in theembodiment 1. The following explanation is made with reference to FIGS.5A and 5B and FIGS. 21A and 21B.

FIG. 21A is a timing chart showing driving using a time divisional grayscale method for obtaining gray scale by utilizing a difference inlighting time. In this figure, a case in which frame frequency is set to60 [Hz], and VGA and four-bit gray scale is illustrated.

One frame period is divided into four subframe periods. Each subframeperiod is completely separated into the address period and the sustainperiod. In the sustain periods Ts₁ to Ts₄,Ts₁:Ts₂:Ts₃:Ts₄=2³:2²:2¹:2⁰=8:4:2:1 is set so that 4 bits=16 gray scalescan be displayed. Since each of the address periods Ta₁ to Ta₄ is aperiod for writing into pixels of one screen, all these address periodsare equal to each other in time interval.

Writing of data performed in one subframe period will be explained.First, digital data inputted through the source signal line aresequentially sampled. After sampling for one horizontal period (sinceVGA is adopted in the case of this embodiment, it corresponds to 640lines+two dummy lines) is terminated, data are simultaneously latched.This operation is repeated for all the gate signal lines (since VGA isadopted in the case of this embodiment, it corresponds to 480 lines+twodummy lines in total). Thus writing of one frame is completed in eachbit.

While this writing is performed, as shown in FIG. 21B, the electricpotential of the cathode 108 is set in advance to be equal to theelectric potential of the electric current supply line (the gate signalline 111 functioning as the electric current supply line when combinedwith the pixel of the present invention). Thus, in this period, novoltage is generated between the anode 109 and the cathode 110 of the ELelement 103, and no electric current flows. Namely, no light is emittedfrom any EL element 103 in the screen during the address period.

During the address period, after the writing of one frame for every bitis completed, the electric potential of the cathode 108 having had thesame electric potential as the electric current supply line till then isreduced, and a voltage is generated between the anode and the cathode ofthe EL element to be lighted. Thus, an electric current flows throughthe EL element 103 and light is emitted from the EL element 103. Thelight emission of the EL element 103 lasts for a certain period afterthe switching TFT 101 is turned off, because the voltage application tothe gate of the EL driving TFT 102 is held by the holding capacitor 104.Accordingly, the light emission is continued for a constant period.

The driving method shown in this embodiment can be easily carried out,and can be easily applied also when the driving method is combined withthe electro-optical device of the present invention.

The switching TFT 101 in FIG. 5B is a double gate TFT here, and the ELdriving TFT 102 is a single gate TFT here. However, in this embodiment,a multi-gate type having three or more gate electrodes may also be usedinstead of the single gate type and the double gate type. The polarityof the TFT may be determined in conformity with the structure of the ELelement, etc.

Embodiment 11

In this embodiment, an external light emitting quantum efficiency can beremarkably improved by using an EL material by which phosphorescencefrom a triplet exciton can be employed for emitting a light. As aresult, the power consumption of the EL element can be reduced, thelifetime of the EL element can be elongated and the weight of the ELelement can be lightened.

The following is a report where the external light emitting quantumefficiency is improved by using the triplet exciton (T. Tsutsui, C.Adachi, S. Saito, Photochemical processes in Organized MolecularSystems, ed. K. Honda, (Elsevier Sci. Pub., Tokyo, 1991) p. 437).

The molecular formula of an EL material (coumarin pigment) reported bythe above article is represented as follows.

(Compound 1)

-   (M. A. Baldo, D. F. O'Brien, Y. You, A. Shoustikov, S. Sibley, M. E.    Thompson, S. R. Forrest, Nature 395 (1998) p. 151)

The molecular formula of an EL material (Pt complex) reported by theabove article is represented as follows.

(Compound 2)

-   (M. A. Baldo, S. Lamansky, P. E. Burrows, M. E. Thompson, S. R.    Forrest, Appl. Phys. Lett., 75 (1999) p. 4.) (T. Tsutsui, M.-J.    Yang, M. Yahiro, K. Nakamura, T. Watanabe, T. Tsuji, Y. Fukuda, T.    Wakimoto, S. Mayaguchi, Jpn, Appl. Phys., 38 (12B) (1999) L1502)

The molecular formula of an EL material (Ir complex) reported by theabove article is represented as follows.

(Compound 3)

As described above, if phosphorescence from a triplet exciton can be putto practical use, it can realize the external light emitting quantumefficiency three to four times as high as that in the case of usingfluorescence from a singlet exciton in principle. The structureaccording to this embodiment can be freely implemented in combination ofany structures of the first to tenth embodiments.

Embodiment 12

An EL display using the electro-optical device in accordance with thepresent invention has superior visibility in bright locations incomparison to a liquid crystal display device because it is of aself-luminous type, and moreover viewing angle is wide. Accordingly, itcan be used as a display portion for various electronic instruments. Forexample, it is appropriate to use the electro-optical display of thepresent invention as a display portion of an EL display having adiagonal equal to 30 inches or greater (typically equal to 40 inches orgreater) for appreciation of TV broadcasts by a large screen.

Note that all displays exhibiting (displaying) information such as apersonal computer display, a TV broadcast reception display, or anadvertisement display are included as the. EL display device. Further,the EL display of the present invention can be used as a display portionof the other various electronic instruments.

The following can be given as examples of such electronic instruments: avideo camera; a digital camera; a goggle type display (head mounteddisplay); a car navigation system; an audio reproducing device (such asa car audio system, an audio compo system); a notebook personalcomputer; a game equipment; a portable information terminal (such as amobile computer, a mobile telephone, a mobile game equipment or anelectronic book); and an image playback device provided with a recordingmedium (specifically, a device which performs playback of a recordingmedium and is provided with a display which can display those images,such as a digital video disk (DVD)). In particular, because portableinformation terminals are often viewed from a diagonal direction, thewideness of the field of vision is regarded as very important. Thus, itis preferable that the EL display is employed. Examples of theseelectronic instruments are shown in FIGS. 22 and 23.

FIG. 22A illustrates an EL display which includes a frame 3301, asupport table 3302, a display portion 3303, or the like. Theelectro-optical display of the present invention can be used as thedisplay portion 3303. The EL display device is of a self-luminous typeand therefore requires no backlight. Thus, the display portion thereofcan have a thickness thinner than that of the liquid crystal displaydevice.

FIG. 22B illustrates a video camera which includes a main body 3311, adisplay portion 3312, an audio input portion 3313, operation switches3314, a battery 3315, an image receiving portion 3316, or the like. Theelectro-optical display device in accordance with the present inventioncan be used as the display portion 3312.

FIG. 22C illustrates a portion (the right-half piece) of a head-mountedtype EL display which includes a main body 3321, signal cables 3322, ahead mount band 3323, a display portion 3324, an optical system 3325, adisplay device 3326, or the like. The electro-optical display device inaccordance with the present invention can be used as the display device3326.

FIG. 22D illustrates an image reproduction apparatus which includes arecording medium (more specifically, a DVD reproduction apparatus),which includes a main body 3331, a recording medium (a DVD or the like)3332, operation switches 3333, a display portion (a) 3334, anotherdisplay portion (b) 3335, or the like. The display portion (a) 3334 isused mainly for displaying image information, while the display portion(b) 3335 is used mainly for displaying character information. Theelectro-optical device in accordance with the present invention can beused as these display portions (a) 3334 and (b) 3335. The imagereproduction apparatus including a recording medium further includes adomestic game equipment or the like.

FIG. 22E illustrates a goggle type display (head-mounted display) whichincludes a main body 3341, a display portion 3342, an arm portion 3343.The electro-optical device in accordance with the present invention canbe used as the display portion 3342.

FIG. 22F illustrates a personal computer which includes a main body3351, a frame 3352, a display portion 3353, a keyboard 3354, or thelike. The electro-optical device in accordance with the presentinvention can be used as the display portion 3353.

Note that if emission luminance of an EL material becomes higher in thefuture, it will be applicable to a front-type or rear-type projector inwhich light including output image information is enlarged by means oflenses or the like to be projected.

The above mentioned electronic instruments are more likely to be usedfor display information distributed through a telecommunication pathsuch as Internet, a CATV (cable television system), and in particularlikely to display moving picture information. The EL display is suitablefor displaying moving pictures since the EL material can exhibit highresponse speed.

Further, since a light emitting portion of the EL display consumespower, it is desirable to display information in such a manner that thelight emitting portion therein becomes as small as possible.Accordingly, when the EL display is applied to a display portion whichmainly displays character information, e.g., a display portion of aportable information terminal, and more particular, a portable telephoneor an audio reproducing device, it is desirable to drive the EL displayso that the character information is formed by a light-emitting portionwhile a non-emission portion corresponds to the background.

FIG. 23A illustrates a portable telephone which includes a main body3401, an audio output portion 3402, an audio input portion 3403, adisplay portion 3404, operation switches 3405, and an antenna 3406. Theelectro-optical display in accordance with the present invention can beused as the display portion 3404. Note that the display portion 3404 canreduce power consumption of the portable telephone by displayingwhite-colored characters on a black-colored background.

Further, FIG. 23B illustrates a sound reproduction device, specifically,a car audio equipment, which includes a main body 3411, a displayportion 3412, and operation switches 3413 and 3414. The electro-opticaldisplay in accordance with the present invention can be used as thedisplay portion 3412. Although the car audio equipment of the mount typeis shown in the present embodiment, the present invention is alsoapplicable to a portable type or domestic sound reproducing device. Thedisplay portion 3414 can reduce power consumption by displayingwhite-colored characters on a black-colored background, which isparticularly advantageous for the portable type sound reproductiondevice.

As set forth above, the present invention can be applied variously to awide range of electronic instruments in all fields. The electronicinstruments in the present embodiment may use an electro-optical devicehaving any one of configurations shown in Embodiments 1 to 11.

The need for a power supply line is eliminated by using theelectro-optical device of the present invention. Therefore, higheraperture ratio can be realized without increasing a mask sheet numberand a step number in a panel making process in comparison with theconventional electro-optical device. In the case where the apertureratio is not higher than but equal to the conventional one, a signalline can be thickened accordingly. Therefore, resistivity is reduced,crosstalk and luminance inclination, etc. can be reduced, and imagequality can be improved.

1. (canceled)
 2. A method of driving a semiconductor device comprising:selecting an i-th gate signal line, thereby turning on a switching TFT;inputting a signal from a source signal line to a gate electrode of a ELdriving TFT through the switching TFT, thereby turning on the EL drivingTFT; supplying a current from an (i−1)-th gate signal line to an ELelement through the EL driving TFT.
 3. A method of driving asemiconductor device comprising: selecting an i-th gate signal line,thereby turning on a switching TFT, in one of a plurality of subgatesignal line selecting periods; selecting a j-th gate signal line,thereby turning on a switching TFT, in another one of the plurality ofsubgate signal line selecting periods; inputting a signal from a sourcesignal line to a gate electrode of a EL driving TFT through theswitching TFT, thereby turning on the EL driving TFT after selecting thei-th gate signal line; and supplying a current from an (i−1)-th gatesignal line to an EL element through the EL driving TFT, wherein each ofi and j is a positive integer and j≧i+2.
 4. A method of driving asemiconductor device comprising: selecting an i-th gate signal line,thereby turning on a switching TFT; inputting a signal from a sourcesignal line to a gate electrode of a EL driving TFT through theswitching TFT, thereby turning on the EL driving TFT; supplying acurrent from an (i−1)-th gate signal line to an EL element through theEL driving TFT; selecting a reset signal line, thereby turning on areset TFT, wherein the current is not supplied to the EL element whilethe reset TFT is in on state.
 5. A method of driving a semiconductordevice comprising: selecting an i-th gate signal line, thereby turningon a switching TFT; inputting a signal from a source signal line to agate electrode of a EL driving TFT through the switching TFT, therebyturning on the EL driving TFT; supplying a current from an (i−1)-th gatesignal line to an EL element through the EL driving TFT; selecting areset signal line, thereby turning off a reset TFT, wherein the currentis not supplied to the EL element while the reset TFT is in off state.6. A method of driving a semiconductor device comprising: selecting ani-th gate signal line, thereby turning on a switching TFT; inputting asignal from a source signal line to a gate electrode of a EL driving TFTthrough the switching TFT, thereby turning on the EL driving TFT;supplying a current from an (i−1)-th gate signal line to an EL elementthrough the EL driving TFT; wherein an electrode of the EL element has asame electric potential as the (i−1)-th gate signal line when selectingthe i-th gate signal line and inputting the signal from the sourcesignal line, and wherein the electrode of the EL element has a lowerelectric potential than the (i−1)-th gate signal line during supplyingthe current from the (i−1)-th gate signal line to the EL element.
 7. Amethod of driving a semiconductor device according to claim 2, whereinthe semiconductor device is a device selected from the group consistingof an EL display, a video camera, a head mount display, a DVD player, apersonal computer, a portable phone and a car audio.
 8. A method ofdriving a semiconductor device according to claim 3, wherein thesemiconductor device is a device selected from the group consisting ofan EL display, a video camera, a head mount display, a DVD player, apersonal computer, a portable phone and a car audio.
 9. A method ofdriving a semiconductor device according to claim 4, wherein thesemiconductor device is a device selected from the group consisting ofan EL display, a video camera, a head mount display, a DVD player, apersonal computer, a portable phone and a car audio.
 10. A method ofdriving a semiconductor device according to claim 5, wherein thesemiconductor device is a device selected from the group consisting ofan EL display, a video camera, a head mount display, a DVD player, apersonal computer, a portable phone and a car audio.
 11. A method ofdriving a semiconductor device according to claim 6, wherein thesemiconductor device is a device selected from the group consisting ofan EL display, a video camera, a head mount display, a DVD player, apersonal computer, a portable phone and a car audio.
 12. A method ofdriving a semiconductor device according to claim 2, wherein a polarityof the switching TFT is the same as a polarity of the EL driving TFT.13. A method of driving a semiconductor device according to claim 3,wherein a polarity of the switching TFT is the same as a polarity of theEL driving TFT.
 14. A method of driving a semiconductor device accordingto claim 4, wherein a polarity of the switching TFT is the same as apolarity of the EL driving TFT.
 15. A method of driving a semiconductordevice according to claim 5, wherein a polarity of the switching TFT isthe same as a polarity of the EL driving TFT.
 16. A method of driving asemiconductor device according to claim 6, wherein a polarity of theswitching TFT is the same as a polarity of the EL driving TFT.
 17. Amethod of driving a semiconductor device according to claim 2, whereinthe signal is an analog signal or a digital signal.
 18. A method ofdriving a semiconductor device according to claim 3, wherein the signalis an analog signal or a digital signal.
 19. A method of driving asemiconductor device according to claim 4, wherein the signal is ananalog signal or a digital signal.
 20. A method of driving asemiconductor device according to claim 5, wherein the signal is ananalog signal or a digital signal.
 21. A method of driving asemiconductor device according to claim 6, wherein the signal is ananalog signal or a digital signal.